M24C04-WBN6P

M24C04-WBN6P

Category: IC Chips

Specifications
SKU
1330714
Details

BUY M24C04-WBN6P https://www.utsource.net/itm/p/1330714.html
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I2C Bus EEPROM
Parameter Symbol Conditions Min Typ Max Unit
Operating Voltage VCC Continuous 1.7 - 5.5 V
Operating Current (Read) IR VCC = 5.5V, f = 1 MHz - 1 - mA
Operating Current (Write) IW VCC = 5.5V, f = 1 MHz - 1.5 - mA
Standby Current ISTBY VCC = 5.5V, f = 0 Hz - 0.1 - μA
Write Cycle Time tWC VCC = 2.5V to 5.5V 5 - - ms
Page Write Time tPW VCC = 2.5V to 5.5V 5 - - ms
Data Retention - 10 - - years
Memory Size - 512 - - bits
Number of Pages - 8 - - pages
Page Size - 64 - - bits
Operating Temperature TOP Continuous -40 - 85 °C
Storage Temperature TSTG Non-operating -65 - 150 °C

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.7V to 5.5V.
    • Avoid sudden changes in supply voltage to prevent data corruption.
  2. Current Consumption:

    • During read operations, the current consumption should not exceed 1mA at 5.5V and 1MHz.
    • During write operations, the current consumption should not exceed 1.5mA at 5.5V and 1MHz.
    • In standby mode, the current consumption should be less than 0.1μA.
  3. Write Operations:

    • Each write cycle takes a minimum of 5ms.
    • Page writes also take a minimum of 5ms.
    • Do not power down or interrupt the device during a write cycle to avoid data corruption.
  4. Data Retention:

    • The device retains data for at least 10 years under normal operating conditions.
  5. Temperature Range:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  6. Memory Management:

    • The device has a total memory size of 512 bits, organized into 8 pages of 64 bits each.
    • Ensure proper page management to avoid overwriting critical data.
  7. Handling:

    • Handle the device with care to avoid physical damage.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.
  8. Mounting:

    • Solder the device according to the recommended reflow profile to ensure reliable connections.
    • Ensure good thermal management if operating in high-temperature environments.
(For reference only)

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