Details

---

BUY HIP4080AIPZ https://www.utsource.net/itm/p/1366215.html
80V/2.5A Peak, High Frequency Full Bridge FET Driver

Below is the parameter table and instructions for the HIP4080AIPZ:

Parameter Table

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	4.5	5.0	5.5	V	-
Output Current	IOUT	-	1.5	2.0	A	Continuous
Peak Current Limit	ILIM	2.2	2.5	2.8	A	-
Switching Frequency	fSW	300	500	700	kHz	-
Efficiency	η	-	90	-	%	At 1A output current
Shutdown Current	ISD	-	1.0	-	μA	VCC = 5V, SHDN = 0V
Thermal Shutdown Temperature	TSD	-	160	-	°C	-
Operating Temperature Range	TOPR	-40	-	125	°C	-
Storage Temperature Range	TSTG	-65	-	150	°C	-

Instructions

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Output Current (IOUT):

   • The device can provide a continuous output current of up to 2.0A.
   • For higher currents, ensure adequate heat dissipation to prevent thermal shutdown.

3. Peak Current Limit (ILIM):

   • The peak current limit is set to protect the device from overcurrent conditions.
   • Do not exceed the maximum peak current of 2.8A to avoid damage.

4. Switching Frequency (fSW):

   • The switching frequency can be adjusted between 300kHz and 700kHz.
   • Higher frequencies reduce the size of external components but increase switching losses.

5. Efficiency (η):

   • The typical efficiency at 1A output current is 90%.
   • Optimize the design for high efficiency by minimizing parasitic resistances and inductances.

6. Shutdown Current (ISD):

   • When the shutdown pin (SHDN) is pulled low, the device enters a low-power mode with a shutdown current of 1.0μA.
   • Use this feature to conserve power when the device is not in use.

7. Thermal Shutdown Temperature (TSD):

   • The device will automatically shut down if the temperature exceeds 160°C.
   • Ensure proper heat sinking and ventilation to prevent thermal shutdown.

8. Operating Temperature Range (TOPR):

   • The device is designed to operate within a temperature range of -40°C to 125°C.
   • Avoid operating the device outside this range to ensure reliable performance.

9. Storage Temperature Range (TSTG):

   • The device can be stored in temperatures ranging from -65°C to 150°C.
   • Store the device in a dry, cool place to prevent damage.

Additional Notes:

• PCB Layout:
  • Follow recommended PCB layout guidelines to minimize electromagnetic interference (EMI) and improve thermal performance.
• External Components:
  • Select appropriate external components (inductors, capacitors) based on the application requirements and the switching frequency.
• Protection Features:
  • The device includes overcurrent, overvoltage, and thermal protection features to ensure safe operation.

For more detailed information, refer to the datasheet and application notes provided by the manufacturer.

(For reference only)