Details

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BUY 74ACT257SCX https://www.utsource.net/itm/p/1399625.html
2-Input Digital Multiplexer

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	2.0	-	5.5	V	-
Input Low Voltage	VIL	-	-	0.8	V	-
Input High Voltage	VIH	2.0	-	-	V	-
Output Low Voltage	VOL	-	0.1	0.4	V	-
Output High Voltage	VOH	2.4	-	VCC - 0.1	V	-
Propagation Delay Time	tpd	-	3.5	6.5	ns	-
Power Dissipation	PD	-	-	100	mW	-
Operating Temperature	TA	-40	-	85	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0V to 5.5V.
   • Avoid exceeding the maximum voltage to prevent damage to the device.

2. Input Voltages (V_IL, V_IH):

   • Inputs should be driven with voltages that fall within the specified ranges to ensure reliable operation.
   • For logic low, the input voltage should not exceed 0.8V.
   • For logic high, the input voltage should be at least 2.0V.

3. Output Voltages (V_OL, V_OH):

   • The output low voltage (V_OL) should be between 0.1V and 0.4V.
   • The output high voltage (V_OH) should be at least 2.4V and no more than V_CC - 0.1V.

4. Propagation Delay Time (t_pd):

   • The typical propagation delay time is 3.5ns, with a maximum of 6.5ns.
   • This parameter is crucial for timing considerations in your circuit design.

5. Power Dissipation (P_D):

   • The maximum power dissipation is 100mW. Ensure adequate heat dissipation if operating near this limit.

6. Operating Temperature (T_A):

   • The device is designed to operate within the temperature range of -40°C to 85°C.
   • Avoid operating outside this range to prevent performance degradation or failure.

7. Storage Temperature (T_STG):

   • Store the device in an environment with temperatures ranging from -65°C to 150°C to maintain its integrity.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use proper ESD protection practices when handling and installing the device.

9. Mounting:

   • Ensure the device is properly mounted on the PCB to avoid mechanical stress.
   • Follow the recommended soldering profile to ensure reliable connections.

10. Testing:

    • Test the device under specified conditions to verify its functionality.
    • Use appropriate test equipment and methods to ensure accurate results.

(For reference only)