Details

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BUY IDT71V016SA12PH https://www.utsource.net/itm/p/1408647.html
x16 SRAM

Parameter	Description	Value
Device Name	IDT71V016SA12PH	-
Function	16K x 8-bit CMOS Static RAM with 3.0V to 3.6V Operation	-
Supply Voltage (VCC)	Operating Range	3.0V to 3.6V
Standby Current (ICC)	Typical at VCC = 3.3V	5 μA
Active Current (ICC)	Typical at VCC = 3.3V, fCLK = 10 MHz	10 mA
Access Time (tAA)	Typical at VCC = 3.3V, fCLK = 10 MHz	10 ns
Data Retention Time	Minimum	10 years
Operating Temperature (TA)	Commercial	0°C to 70°C
Storage Temperature (TSTG)	-	-65°C to 150°C
Package	-	SOIC-28, TSSOP-28
Pin Count	-	28
Write Enable (WE#)	Active Low	-
Output Enable (OE#)	Active Low	-
Chip Select (CS#)	Active Low	-
Address Lines (A0-A13)	14-bit Address Input	-
Data Lines (D0-D7)	8-bit Data I/O	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 3.0V to 3.6V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Signal Levels:

   • All input signals (e.g., WE#, OE#, CS#, A0-A13) should be TTL/CMOS compatible.
   • Ensure that all inputs are either pulled high or low when not actively driven to avoid floating states.

3. Write Operation:

   • To write data, set the Write Enable (WE#) and Chip Select (CS#) pins low.
   • Apply the desired address to the address lines (A0-A13).
   • Present the data on the data lines (D0-D7).
   • After the write cycle, return WE# to high to complete the operation.

4. Read Operation:

   • To read data, set the Output Enable (OE#) and Chip Select (CS#) pins low.
   • Apply the desired address to the address lines (A0-A13).
   • The data will appear on the data lines (D0-D7) after the access time (tAA).

5. Standby Mode:

   • To minimize power consumption, set the Chip Select (CS#) pin high.
   • This will place the device in standby mode, reducing the current draw to the typical standby current (ICC).

6. Temperature Considerations:

   • Operate the device within the specified temperature range (0°C to 70°C) for reliable performance.
   • Store the device in the specified storage temperature range (-65°C to 150°C).

7. Handling Precautions:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use proper ESD protection equipment and follow standard handling procedures.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the package.
   • Follow the recommended footprint and soldering profile for the selected package type (SOIC-28 or TSSOP-28).

(For reference only)