TC7WH125FK
Specifications
SKU
1409688
Details
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DUAL BUS BUFFER
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.3 | - | 6.0 | V |
| Output Current (Sink) | IO(S) | - | 100 | - | mA |
| Output Current (Source) | IO(SR) | - | 50 | - | mA |
| Input Voltage (High) | VIH | 2.0 | - | 6.0 | V |
| Input Voltage (Low) | VIL | -0.3 | - | 0.8 | V |
| Output Voltage (High) | VOH | 2.4 | - | VCC-0.4 | V |
| Output Voltage (Low) | VOL | -0.1 | - | 0.4 | V |
| Propagation Delay Time | tpd | - | 15 | - | ns |
| Power Dissipation | PD | - | - | 150 | mW |
| Operating Temperature | TOP | -40 | - | 85 | °C |
| Storage Temperature | TSTG | -55 | - | 150 | °C |
Instructions for Use:
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of -0.3V to 6.0V to avoid damage to the device.
Output Current:
- The device can sink up to 100mA and source up to 50mA. Do not exceed these limits to prevent overheating and potential failure.
Input Voltage Levels:
- For high input, the voltage should be between 2.0V and 6.0V.
- For low input, the voltage should be between -0.3V and 0.8V.
Output Voltage Levels:
- When the output is high, the voltage will be between 2.4V and VCC-0.4V.
- When the output is low, the voltage will be between -0.1V and 0.4V.
Propagation Delay:
- The typical propagation delay time is 15ns. This is the time it takes for the output to respond to a change in the input signal.
Power Dissipation:
- The maximum power dissipation is 150mW. Ensure adequate heat dissipation if operating near this limit.
Operating Temperature:
- The device is designed to operate within the temperature range of -40°C to 85°C. Avoid operating outside this range to maintain reliability.
Storage Temperature:
- Store the device in an environment with temperatures ranging from -55°C to 150°C to prevent damage during storage.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Follow proper soldering techniques to ensure reliable connections and avoid thermal stress on the device.
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