Details
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9A High-Speed MOSFET Drivers
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 4.5 | - | 18 | V |
| Quiescent Current | IQ | VCC = 5V, No Load | - | 0.2 | - | mA |
| Output Current (Source) | IOH | VCC = 5V, VOUT = 3.5V | 500 | - | - | mA |
| Output Current (Sink) | IOL | VCC = 5V, VOUT = 0V | 500 | - | - | mA |
| Propagation Delay Time (High to Low) | tPLH | VCC = 5V, VIH = VCC, VIL = 0V, CL = 15pF | - | 16 | - | ns |
| Propagation Delay Time (Low to High) | tPHL | VCC = 5V, VIH = VCC, VIL = 0V, CL = 15pF | - | 16 | - | ns |
| Input Voltage (High Level) | VIH | Input Current 1μA | - | 2.0 | VCC | V |
| Input Voltage (Low Level) | VIL | Input Current -1μA | 0 | - | 0.8 | V |
| Maximum Junction Temperature | TJ(max) | - | - | - | 150 | °C |
| Storage Temperature Range | TSTG | - | -40 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the operating range of 4.5V to 18V.
- Connect a decoupling capacitor (e.g., 0.1μF) close to the VCC pin to filter out noise.
Input Signals:
- Apply input signals that meet the specified high (VIH) and low (VIL) voltage levels.
- The input current should be within the specified limits to avoid damage.
Output Load:
- The output can source or sink up to 500mA. Ensure the load does not exceed this limit.
- For optimal performance, use a load capacitance (CL) of 15pF or less.
Propagation Delay:
- The propagation delay times (tPLH and tPHL) are crucial for timing considerations. Ensure your design accounts for these delays.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed 150°C.
- If necessary, use heat sinks or other cooling methods to manage heat dissipation.
Storage:
- Store the device in an environment with a temperature range between -40°C and 150°C to prevent damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow proper ESD (Electrostatic Discharge) precautions when handling and soldering the device.
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