Details

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BUY MM74C240WM https://www.utsource.net/itm/p/1553664.html
IC BUFFER INVERT 15V 20SOIC

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	4.5	5	5.5	V
Input Voltage (High)	VIH	3.15	-	Vcc	V
Input Voltage (Low)	VIL	0	-	2.34	V
Output Voltage (High)	VOH	2.4	-	Vcc-0.5	V
Output Voltage (Low)	VOL	0	-	0.6	V
Input Current (High)	IIH	-	1	20	μA
Input Current (Low)	IIL	-20	-1	-	μA
Output Current (High)	IOH	-	-400	-	μA
Output Current (Low)	IOL	-	8	16	mA
Propagation Delay Time	tpd	9	15	22	ns
Power Dissipation	PD	-	-	100	mW
Operating Temperature	Topr	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V.
   • Use a stable power supply to avoid fluctuations that can affect performance.

2. Input Voltage Levels:

   • For a logic high input, the voltage should be at least 3.15V.
   • For a logic low input, the voltage should not exceed 2.34V.

3. Output Voltage Levels:

   • The output voltage for a high state should be at least 2.4V but can go up to Vcc - 0.5V.
   • The output voltage for a low state should not exceed 0.6V.

4. Current Ratings:

   • Ensure that the input current does not exceed 20μA for high inputs and -20μA for low inputs.
   • The output current for high outputs should not exceed -400μA, and for low outputs, it should not exceed 16mA.

5. Propagation Delay:

   • The typical propagation delay time is 15ns, with a minimum of 9ns and a maximum of 22ns.

6. Power Dissipation:

   • The maximum power dissipation is 100mW. Ensure proper heat dissipation if operating near this limit.

7. Temperature Ranges:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is from -65°C to 150°C.

8. Handling and Storage:

   • Handle the MM74C240WM with care to avoid static damage.
   • Store in a dry, cool place within the specified storage temperature range.

9. Mounting and Soldering:

   • Follow standard soldering practices to ensure reliable connections.
   • Avoid overheating during soldering to prevent damage to the component.

10. Testing:

    • Test the component under controlled conditions to verify its functionality before integrating it into a larger circuit.

(For reference only)