MC14556BCP

MC14556BCP


Specifications
SKU
1731102
Details

BUY MC14556BCP https://www.utsource.net/itm/p/1731102.html
Single Channel 1.8V SVS w/ Watchdog and /MR in 5/SOT23 5-SOT-23 -40 to 85
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage Vcc 2.0 - 6.0 V Operating Range
Supply Current (Typical) ICC - 20 - μA Vcc = 5V, No Load
Output Current (Sink) IOL - 10 25 mA Vcc = 5V, VO = 0.4V
Output Current (Source) IOH - 1 5 mA Vcc = 5V, VO = 4.6V
Output Low Voltage VOL - 0.4 - V IOL = 10mA
Output High Voltage VOH - 4.6 - V IOH = 1mA
Input Voltage (Low) VIH - 3.5 - V Vcc = 5V
Input Voltage (High) VIL - 1.5 - V Vcc = 5V
Propagation Delay Time tpd - 10 35 ns Vcc = 5V, TA = 25°C
Operating Temperature TA -40 - 85 °C Storage Temperature: -65°C to 150°C

Instructions for Use:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 2.0V to 6.0V to avoid damage to the device.
  2. Supply Current (ICC):

    • The typical supply current is 20μA at 5V. Ensure your power supply can handle this current.
  3. Output Current:

    • The device can sink up to 25mA and source up to 5mA. Do not exceed these limits to prevent damage.
  4. Output Voltage Levels:

    • When sourcing current, the output high voltage (VOH) is typically 4.6V.
    • When sinking current, the output low voltage (VOL) is typically 0.4V.
  5. Input Voltage Levels:

    • For a logic high input, the voltage should be at least 3.5V.
    • For a logic low input, the voltage should be no more than 1.5V.
  6. Propagation Delay Time (tpd):

    • The typical propagation delay time is 10ns at 25°C. This can vary between 10ns and 35ns.
  7. Operating Temperature (TA):

    • The device operates reliably between -40°C and 85°C. Store the device between -65°C and 150°C.
  8. Handling:

    • Handle the device with care to avoid static discharge which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections.
  9. Mounting:

    • Ensure the device is securely mounted on the PCB to prevent mechanical stress.
    • Use appropriate thermal management techniques if operating in high-temperature environments.
  10. Testing:

    • Test the device under specified conditions to ensure it meets the required performance parameters.
(For reference only)

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