MC14556BCP
Specifications
SKU
1731102
Details
BUY MC14556BCP https://www.utsource.net/itm/p/1731102.html
Single Channel 1.8V SVS w/ Watchdog and /MR in 5/SOT23 5-SOT-23 -40 to 85
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 2.0 | - | 6.0 | V | Operating Range |
| Supply Current (Typical) | ICC | - | 20 | - | μA | Vcc = 5V, No Load |
| Output Current (Sink) | IOL | - | 10 | 25 | mA | Vcc = 5V, VO = 0.4V |
| Output Current (Source) | IOH | - | 1 | 5 | mA | Vcc = 5V, VO = 4.6V |
| Output Low Voltage | VOL | - | 0.4 | - | V | IOL = 10mA |
| Output High Voltage | VOH | - | 4.6 | - | V | IOH = 1mA |
| Input Voltage (Low) | VIH | - | 3.5 | - | V | Vcc = 5V |
| Input Voltage (High) | VIL | - | 1.5 | - | V | Vcc = 5V |
| Propagation Delay Time | tpd | - | 10 | 35 | ns | Vcc = 5V, TA = 25°C |
| Operating Temperature | TA | -40 | - | 85 | °C | Storage Temperature: -65°C to 150°C |
Instructions for Use:
Supply Voltage (Vcc):
- Ensure the supply voltage is within the range of 2.0V to 6.0V to avoid damage to the device.
Supply Current (ICC):
- The typical supply current is 20μA at 5V. Ensure your power supply can handle this current.
Output Current:
- The device can sink up to 25mA and source up to 5mA. Do not exceed these limits to prevent damage.
Output Voltage Levels:
- When sourcing current, the output high voltage (VOH) is typically 4.6V.
- When sinking current, the output low voltage (VOL) is typically 0.4V.
Input Voltage Levels:
- For a logic high input, the voltage should be at least 3.5V.
- For a logic low input, the voltage should be no more than 1.5V.
Propagation Delay Time (tpd):
- The typical propagation delay time is 10ns at 25°C. This can vary between 10ns and 35ns.
Operating Temperature (TA):
- The device operates reliably between -40°C and 85°C. Store the device between -65°C and 150°C.
Handling:
- Handle the device with care to avoid static discharge which can damage sensitive components.
- Follow proper soldering techniques to ensure reliable connections.
Mounting:
- Ensure the device is securely mounted on the PCB to prevent mechanical stress.
- Use appropriate thermal management techniques if operating in high-temperature environments.
Testing:
- Test the device under specified conditions to ensure it meets the required performance parameters.
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