Details

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BUY XC5204-6VQ100C https://www.utsource.net/itm/p/1740102.html
Field Programmable Gate Arrays

Parameter	Description	Value
Device Name	Xilinx Spartan-XL FPGA	XC5204-6VQ100C
Package Type	Plastic Quad Flatpack (PQFP)	100-Pin
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Configuration Memory	Non-Volatile Flash Memory	512 Kbits
Logic Cells	Number of Logic Cells	4,096
I/O Pins	Number of User I/O Pins	72
Clock Managers	Digital Clock Managers (DCMs)	2
Block RAM	Total Block RAM Size	188 Kbits
Multipliers	18x18 Multipliers	4
Configuration Interface	JTAG, Boundary Scan	Supported
Power Supply	Core Voltage (Vccint)	3.3V
I/O Voltage (Vcco)	3.3V
Standby Current	Typical Standby Current	100 μA
Active Power	Typical Active Power at 100 MHz	350 mW
Configuration Time	Typical Configuration Time from Flash	10 ms
Speed Grade	-6

Instructions for Use:

1. Power Supply:

   • Ensure that the core voltage (Vccint) is set to 3.3V.
   • The I/O voltage (Vcco) should also be set to 3.3V.

2. Configuration:

   • The device can be configured using JTAG or boundary scan.
   • For initial configuration, use the provided Flash memory or an external programmer.
   • Configuration time from Flash is typically around 10 ms.

3. Clock Management:

   • Utilize the two Digital Clock Managers (DCMs) for clock synthesis and management.
   • DCMs can be used to generate multiple clock frequencies and phases.

4. I/O Usage:

   • The device has 72 user I/O pins, which can be configured for various input/output functions.
   • Ensure proper termination and signal integrity for high-speed signals.

5. Operating Temperature:

   • The device is rated for industrial temperature range (-40°C to +85°C).
   • Ensure adequate cooling if operating near the upper temperature limit.

6. Power Consumption:

   • The typical active power consumption at 100 MHz is 350 mW.
   • The typical standby current is 100 μA.

7. Multipliers:

   • The device includes four 18x18 multipliers for arithmetic operations.
   • These can be used for DSP applications or other compute-intensive tasks.

8. Block RAM:

   • The total block RAM size is 188 Kbits, which can be used for data storage, FIFOs, and other memory-based functions.

9. Logic Cells:

   • The device contains 4,096 logic cells, which can be used to implement complex digital logic functions.

10. Handling:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD precautions when handling and installing the device.

For detailed design guidelines and specific application notes, refer to the Xilinx documentation for the Spartan-XL family.

(For reference only)