Details

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BUY DM74ALS04BN https://www.utsource.net/itm/p/1741713.html
Hex Inverters; Package: DIP; No of Pins: 14; Container: Rail

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage range	1.5	-	5.5	V
Input Voltage (VIH)	High-level input voltage	2.0	-	5.5	V
Input Voltage (VIL)	Low-level input voltage	0.0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	2.4	-	VCC - 0.5	V
Output Voltage (VOL)	Low-level output voltage	0.0	-	0.4	V
Input Current (IIH)	High-level input current	-	-	20	μA
Input Current (IIL)	Low-level input current	-20	-	-	μA
Output Current (IOH)	High-level output current	-	-	-400	μA
Output Current (IOL)	Low-level output current	-800	-	-	μA
Propagation Delay Time (tpd)	Typical propagation delay time	-	9	-	ns
Power Dissipation (PTOT)	Total power dissipation	-	-	330	mW
Operating Temperature Range (TA)	Ambient operating temperature range	-55	-	125	°C
Storage Temperature Range (TSTG)	Storage temperature range	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 1.5V to 5.5V.
   • Connect V_CC to the positive power supply and GND to the ground.

2. Input Signals:

   • Apply high-level input voltages (V_IH) between 2.0V and 5.5V.
   • Apply low-level input voltages (V_IL) between 0.0V and 0.8V.
   • Ensure input currents (I_IH and I_IL) do not exceed the specified limits.

3. Output Signals:

   • The high-level output voltage (V_OH) will be between 2.4V and V_CC - 0.5V.
   • The low-level output voltage (V_OL) will be between 0.0V and 0.4V.
   • Ensure output currents (I_OH and I_OL) do not exceed the specified limits.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 9 nanoseconds.

5. Environmental Conditions:

   • Operate the device within the ambient temperature range of -55°C to 125°C.
   • Store the device within the temperature range of -65°C to 150°C.

6. Power Dissipation:

   • Ensure the total power dissipation (P_TOT) does not exceed 330 milliwatts.

7. Handling:

   • Handle the device with care to avoid static damage.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.

(For reference only)