Details

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BUY SN74LS169BN https://www.utsource.net/itm/p/1743061.html
SYNCHRONOUS 4-BIT UP/DOWN BINARY COUNTERS

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (Vcc)	Operating supply voltage	4.75	5.0	5.25	V
Input Voltage (VIH)	High-level input voltage	2.0	-	5.25	V
Input Voltage (VIL)	Low-level input voltage	0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	2.4	-	5.0	V
Output Voltage (VOL)	Low-level output voltage	0	-	0.4	V
Input Current (IIH)	High-level input current	-	-	20	μA
Input Current (IIL)	Low-level input current	-1.6	-	-	mA
Output Current (IOH)	High-level output current	-	-	-400	μA
Output Current (IOL)	Low-level output current	-400	-	-	μA
Propagation Delay Time (tPD)	Typical propagation delay time	-	23	-	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	630	mW
Operating Temperature (Toper)	Operating temperature range	-55	-	125	°C
Storage Temperature (Tstg)	Storage temperature range	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range (4.75V to 5.25V).
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply high-level input voltages (VIH) between 2.0V and 5.25V.
   • Apply low-level input voltages (VIL) between 0V and 0.8V.
   • Keep input currents within the specified limits to avoid damage.

3. Output Signals:

   • The high-level output voltage (VOH) will be between 2.4V and 5.0V.
   • The low-level output voltage (VOL) will be between 0V and 0.4V.
   • Ensure that the output currents (IOH and IOL) do not exceed the maximum ratings.

4. Timing:

   • Consider the typical propagation delay time (tPD) of 23ns when designing your circuit to ensure proper timing.

5. Thermal Management:

   • The device can dissipate up to 630mW of power. Ensure adequate heat sinking if operating near this limit.
   • Operate the device within the specified temperature ranges to prevent thermal damage.

6. Storage:

   • Store the device in a controlled environment with temperatures between -65°C and 150°C to maintain its integrity.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.

8. Testing:

   • Test the device under the recommended conditions to ensure it meets the specified performance parameters.

9. Soldering:

   • Use appropriate soldering techniques and temperatures to avoid damaging the device during assembly.

10. Compliance:

    • Ensure that the design and application comply with all relevant safety and regulatory standards.

(For reference only)