Details

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BUY AT28HC256-70PC https://www.utsource.net/itm/p/1832755.html
256 32K x 8 High Speed Parallel EEPROMs

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.5	-	5.5	V
Standby Current	ICC(SB)	VCC = 5V, VPP = 0V	1.0	-	20	μA
Active Current	ICC(ACT)	VCC = 5V, VPP = 12.5V	10	-	30	mA
Output High Level Voltage	VOH	VCC = 5V, IO = -0.4mA	2.4	-	5.0	V
Output Low Level Voltage	VOL	VCC = 5V, IO = 4.0mA	0.0	-	0.5	V
Input Low Level Voltage	VIL	-	0.0	-	0.8	V
Input High Level Voltage	VIH	-	2.0	-	5.5	V
Access Time	tACC	VCC = 5V, VPP = 12.5V	70	-	-	ns
Chip Enable Setup Time	tCE(S)	-	0	-	20	ns
Chip Enable Hold Time	tCE(H)	-	0	-	20	ns
Output Enable Setup Time	tOE(S)	-	0	-	20	ns
Output Enable Hold Time	tOE(H)	-	0	-	20	ns
Write Enable Setup Time	tWE(S)	-	0	-	20	ns
Write Enable Hold Time	tWE(H)	-	0	-	20	ns
Address Setup Time	tAS	-	0	-	20	ns
Address Hold Time	tAH	-	0	-	20	ns
Data Output Valid Time	tDOV	-	0	-	20	ns

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
   • The standby current (ICC(SB)) should not exceed 20μA when VCC is 5V and VPP is 0V.
   • The active current (ICC(ACT)) should not exceed 30mA when VCC is 5V and VPP is 12.5V.

2. Signal Levels:

   • Output high level voltage (VOH) should be between 2.4V and 5.0V when VCC is 5V and the output current (IO) is -0.4mA.
   • Output low level voltage (VOL) should be between 0.0V and 0.5V when VCC is 5V and the output current (IO) is 4.0mA.
   • Input low level voltage (VIL) should be between 0.0V and 0.8V.
   • Input high level voltage (VIH) should be between 2.0V and 5.5V.

3. Timing Parameters:

   • Access time (tACC) must be less than or equal to 70ns when VCC is 5V and VPP is 12.5V.
   • All setup and hold times (tCE(S), tCE(H), tOE(S), tOE(H), tWE(S), tWE(H), tAS, tAH, tDOV) should be within the specified ranges to ensure proper operation.

4. Programming:

   • Apply the programming voltage (VPP) of 12.5V to the appropriate pin during write operations.
   • Ensure that all timing parameters are met during write operations to avoid data corruption.

5. Handling:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry, cool place to prevent moisture damage.

6. Testing:

   • Before integrating the device into a circuit, test it using the specified conditions to ensure it meets the performance criteria.

7. Layout:

   • Place the device close to other components to minimize signal degradation.
   • Use decoupling capacitors near the power pins to filter out noise and ensure stable operation.

(For reference only)