Details

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BUY FST3253MX https://www.utsource.net/itm/p/1862422.html
IC MUX/DEMUX 2 X 4:1 16SOIC

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	1.7	-	3.6	V	Operating voltage range
Output Current	IOUT	-	100	200	mA	Maximum output current
Quiescent Current	IQ	-	1.5	2.5	μA	Current consumption in active mode
Shutdown Current	ISD	-	0.1	0.5	μA	Current consumption in shutdown mode
Operating Temperature	TOPR	-40	-	85	°C	Operating temperature range
Storage Temperature	TSTG	-55	-	150	°C	Storage temperature range
Input Capacitance	CIN	-	2	4	pF	Input capacitance
Output Capacitance	COUT	-	10	22	pF	Output capacitance
Rise Time	TR	-	5	10	ns	Rise time from 10% to 90%
Fall Time	TF	-	5	10	ns	Fall time from 90% to 10%
Propagation Delay	TPDL	-	5	10	ns	Propagation delay (low to high)
Propagation Delay	TPDH	-	5	10	ns	Propagation delay (high to low)
Skew	TSKEW	-	1	3	ns	Maximum skew between outputs
Output Low Voltage	VOL	-	0.1	0.4	V	Output voltage when low
Output High Voltage	VOH	2.4	-	VDD	V	Output voltage when high
Input Low Voltage	VIL	-	0.8	1.2	V	Input voltage recognized as low
Input High Voltage	VIH	2.0	-	VDD	V	Input voltage recognized as high

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 1.7V to 3.6V.
   • Connect a bypass capacitor (10nF to 100nF) close to the VDD pin to filter out noise.

2. Output Current:

   • The device can provide up to 200mA of output current, but typical applications should not exceed 100mA to ensure reliable operation.

3. Quiescent and Shutdown Current:

   • In active mode, the quiescent current is typically 1.5μA.
   • To reduce power consumption, use the shutdown feature which reduces current to 0.1μA.

4. Temperature Considerations:

   • The operating temperature range is -40°C to 85°C.
   • For storage, the device can withstand temperatures from -55°C to 150°C.

5. Capacitance:

   • Use input and output capacitors as specified to ensure stable operation and minimize signal distortion.

6. Timing Parameters:

   • Pay attention to rise and fall times, propagation delays, and skew to ensure proper timing in your circuit.

7. Input and Output Voltages:

   • Ensure that input voltages (VIL and VIH) and output voltages (VOL and VOH) are within the specified ranges to avoid incorrect operation.

8. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.

9. Mounting:

   • Follow recommended PCB layout guidelines for optimal performance and thermal management.

(For reference only)