Details

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BUY BD8162EKV https://www.utsource.net/itm/p/1862838.html
12V Input Multi-channel System Power Supply IC

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.5	-	30	V
Output Current	IO	Continuous	-	2.0	-	A
Quiescent Current	IQ	VCC = 12V, IOUT = 0A	-	2.5	-	mA
Dropout Voltage	VD	IOUT = 1.5A	-	1.7	-	V
Thermal Shutdown	TSD	Activation	-	160	-	°C
Operating Temperature	TOPR	Junction	-40	-	125	°C
Storage Temperature	TSTG	-	-40	-	150	°C

Instructions for BD8162EKV

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 4.5V to 30V.
   • Exceeding this range can damage the device.

2. Output Current (IO):

   • The device can provide a continuous output current of up to 2.0A.
   • Do not exceed this limit to avoid overheating and potential damage.

3. Quiescent Current (IQ):

   • At a supply voltage of 12V and no load (IOUT = 0A), the quiescent current is typically 2.5mA.
   • This value helps in power consumption calculations when the device is idle.

4. Dropout Voltage (VD):

   • The dropout voltage is typically 1.7V at an output current of 1.5A.
   • Ensure that the input voltage is at least 1.7V higher than the desired output voltage to maintain regulation.

5. Thermal Shutdown (TSD):

   • The device will activate thermal shutdown at approximately 160°C to protect against overheating.
   • Design the system to ensure proper heat dissipation and avoid reaching this temperature.

6. Operating Temperature (TOPR):

   • The operating temperature range for the junction is -40°C to 125°C.
   • Ensure the device operates within this range to maintain reliability and performance.

7. Storage Temperature (TSTG):

   • The storage temperature range is -40°C to 150°C.
   • Store the device in a controlled environment to prevent damage due to extreme temperatures.

8. Mounting and Layout:

   • Use appropriate mounting techniques to ensure good thermal management.
   • Place the device away from high-temperature components and ensure adequate airflow.

9. Capacitors:

   • Use recommended input and output capacitors to stabilize the supply and output voltages.
   • Follow the datasheet recommendations for capacitor values and types.

10. PCB Design:

    • Design the PCB layout to minimize trace lengths and inductance.
    • Use wide traces for power and ground connections to reduce resistance and improve thermal performance.

(For reference only)