Details

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BUY FAN7382M1X https://www.utsource.net/itm/p/1868213.html
Driver 600V 2-OUT High and Low Side Half Brdg Non-Inv 14-Pin SOP T/R

Parameter	Symbol	Test Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	-	4.5	-	20	V
Output Current	IOUT	-	-	2.5	5	A
Switching Frequency	fSW	RT = 10 kΩ	100	200	500	kHz
Duty Cycle Range	D	-	0	-	1	-
Quiescent Current	IQ	VIN = 12V, No Load	-	1.5	-	mA
Shutdown Current	ISD	VIN = 12V, Shutdown Mode	-	10	-	μA
Maximum Junction Temperature	TJ(MAX)	-	-	-	150	°C

Instructions for Using the FAN7382M1X

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 4.5V to 20V.
   • Use appropriate filtering capacitors to stabilize the input voltage.

2. Output Current (IOUT):

   • The typical output current is 2.5A, with a maximum of 5A.
   • Design the external components (inductors, capacitors) to handle the maximum current.

3. Switching Frequency (fSW):

   • The switching frequency can be adjusted by changing the value of the resistor (RT).
   • For example, use a 10kΩ resistor for a typical frequency of 200kHz.

4. Duty Cycle Range (D):

   • The duty cycle can vary from 0 to 1, allowing for a wide range of output voltages.
   • Adjust the feedback network to set the desired output voltage.

5. Quiescent Current (IQ):

   • The quiescent current is typically 1.5mA at 12V input with no load.
   • This value helps in estimating the power consumption in no-load conditions.

6. Shutdown Current (ISD):

   • In shutdown mode, the current consumption drops to approximately 10μA.
   • Use the shutdown pin to control the operation of the device.

7. Maximum Junction Temperature (TJ(MAX)):

   • The maximum junction temperature should not exceed 150°C.
   • Ensure proper heat dissipation and cooling to maintain safe operating temperatures.

8. PCB Layout:

   • Place the input and output capacitors close to the IC to minimize parasitic inductance.
   • Use wide traces for high-current paths to reduce resistance and heating.

9. Protection Features:

   • The device includes overcurrent protection, thermal shutdown, and undervoltage lockout.
   • These features help protect the IC and external components from damage.

10. Application Notes:

    • Refer to the datasheet for detailed application notes and circuit diagrams.
    • Consider using the evaluation board for initial testing and development.

(For reference only)