Details

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BUY DS1743P-100 https://www.utsource.net/itm/p/1906885.html
Y2KC Nonvolatile Timekeeping RAM

Parameter	Description	Value	Units
Part Number	Device Identifier	DS1743P-100	-
Function	Device Function	Precision 4-Channel ADC with I2C Interface	-
Supply Voltage	Operating Voltage Range	2.7 to 5.5	V
Supply Current	Active Mode Current Consumption	200	μA
Standby Current	Standby Mode Current Consumption	1	μA
Input Channels	Number of Analog Input Channels	4	-
Resolution	ADC Resolution	12-bit	-
Conversion Time	Time for One Conversion	100	μs
Input Range	Range of Input Voltages	0 to VDD	V
Interface	Communication Protocol	I2C	-
Operating Temperature	Temperature Range	-40 to +85	°C
Package	Physical Package Type	SOIC-16	-

Instructions for Using DS1743P-100

1. Power Supply:

   • Connect the VDD pin to a power supply within the range of 2.7V to 5.5V.
   • Connect the GND pin to the ground.

2. I2C Interface:

   • Connect the SDA (Data) and SCL (Clock) pins to the I2C bus.
   • Ensure that pull-up resistors are connected to the SDA and SCL lines to VDD.

3. Configuration:

   • Use the I2C interface to configure the device settings such as channel selection and conversion mode.
   • The device has a default address, but it can be changed if necessary.

4. Analog Inputs:

   • Connect the analog signals to the input channels (AIN0, AIN1, AIN2, AIN3).
   • Ensure that the input voltages are within the range of 0 to VDD.

5. Conversion:

   • Initiate a conversion by writing to the control register.
   • Read the conversion results from the data register.

6. Standby Mode:

   • To reduce power consumption, put the device into standby mode by setting the appropriate bit in the control register.
   • The device will consume approximately 1 μA in standby mode.

7. Temperature Considerations:

   • Ensure that the operating temperature is within the range of -40°C to +85°C.
   • Avoid exposing the device to temperatures outside this range to prevent damage or inaccurate readings.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.

9. Mounting:

   • Mount the device on a PCB using the recommended soldering profile for SOIC-16 packages.
   • Ensure proper thermal management if the device is expected to operate at high temperatures.

(For reference only)