Details

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BUY VUB160-16NOXT https://www.utsource.net/itm/p/1917015.html
Trans IGBT Module N-CH 1200V 250A 695mW 12-Pin V2-Pack Box

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	4.5	5	5.5	V
Output Current per Channel	Iout	-	100	150	mA
Operating Temperature	Topr	-40	-	85	°C
Storage Temperature	Tstg	-40	-	125	°C
Input Voltage (High)	VIH	3.15	-	5.5	V
Input Voltage (Low)	VIL	0	-	1.35	V
Propagation Delay Time	tpd	10	-	50	ns
Power Dissipation	PD	-	-	700	mW
Isolation Voltage	Viso	-	-	2500	Vrms

Instructions for Using VUB160-16NOXT

1. Power Supply:

   • Ensure the supply voltage ( V_ ) is within the range of 4.5V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Output Current:

   • The maximum output current per channel is 150mA, but it is recommended to operate at or below 100mA to ensure reliable operation and longevity.
   • If higher currents are required, consider using external drivers.

3. Temperature Considerations:

   • The operating temperature range is from -40°C to 85°C. Ensure the device is not exposed to temperatures outside this range during operation.
   • The storage temperature range is from -40°C to 125°C. Store the device in a dry, cool place when not in use.

4. Input Voltage Levels:

   • For a high input level, ( V_ ) should be between 3.15V and 5.5V.
   • For a low input level, ( V_ ) should be between 0V and 1.35V.
   • Ensure input signals are within these ranges to prevent incorrect operation.

5. Propagation Delay:

   • The propagation delay time ( t_ ) is typically between 10ns and 50ns. This should be considered when designing timing-critical applications.

6. Power Dissipation:

   • The maximum power dissipation is 700mW. Ensure adequate heat sinking or cooling if the device is expected to dissipate significant power.

7. Isolation Voltage:

   • The isolation voltage ( V_ ) is 2500Vrms. This provides protection against high-voltage transients and ensures safe operation in environments with potential electrical hazards.

8. Handling and Storage:

   • Handle the device with care to avoid damage from static electricity. Use ESD-safe practices.
   • Store the device in a clean, dry environment to prevent corrosion and other forms of degradation.

9. Mounting and Soldering:

   • Follow standard soldering guidelines to ensure proper connection and to avoid thermal stress on the device.
   • Use a soldering iron with a temperature-controlled tip to prevent overheating.

10. Testing and Troubleshooting:

    • Before final assembly, test the device to ensure it meets all specified parameters.
    • If issues arise, check for correct power supply levels, proper connections, and adherence to temperature and current limits.

(For reference only)