Details
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Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Forward Voltage | V_F | IF = 20 mA | 1.8 | 2.2 | V | |
Reverse Current | I_R | VR = 5 V | 10 | μA | ||
Peak Forward Current | I_FM | Pulse Width ≤ 1 ms | 100 | mA | ||
Total Power Dissipation | P_T | Ta = 25°C | 100 | mW | ||
Operating Temperature | T_op | -40 | 85 | °C | ||
Storage Temperature | T_stg | -40 | 100 | °C |
Instructions for BSM181A
- Handling: Use caution when handling the device to avoid damage from electrostatic discharge (ESD). Ensure proper grounding.
- Mounting: Follow standard surface mount technology (SMT) procedures for mounting. Ensure the correct orientation of the diode during placement.
- Soldering: Use a soldering temperature not exceeding 260°C for a maximum duration of 10 seconds per joint. Avoid overheating which can damage the component.
- Power Handling: Do not exceed the peak forward current or total power dissipation limits specified in the table to prevent thermal damage.
- Environmental Conditions: Operate within the specified temperature ranges to ensure reliable performance and longevity.
- Testing: After installation, verify the functionality of the device under typical operating conditions as outlined in the parameter table.
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