Details

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BUY CS8312YN8 https://www.utsource.net/itm/p/1924920.html
Ignition Predriver

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	4.5	5.0	5.5	V	Operating supply voltage
Output Current	IOUT	-	1.2	1.5	A	Maximum continuous output current
Quiescent Current	IQ	-	1.5	2.0	mA	Supply current at no load
Dropout Voltage	VDROPOUT	-	0.3	0.5	V	Voltage difference between input and output when fully loaded
Thermal Shutdown	TSD	-	160	170	°C	Temperature at which the device shuts down to prevent damage
Operating Temperature	TOPR	-40	-	85	°C	Ambient temperature range for operation
Storage Temperature	TSTG	-65	-	150	°C	Temperature range for storage

Instructions for Use:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current (IOUT):

   • The maximum continuous output current is 1.5A. Do not exceed this limit to prevent overheating and potential failure.

3. Quiescent Current (IQ):

   • The quiescent current is typically 1.5mA and can go up to 2.0mA. This is the current drawn by the device when there is no load.

4. Dropout Voltage (VDROPOUT):

   • The dropout voltage is the difference between the input and output voltages when the device is fully loaded. It is typically 0.3V and can go up to 0.5V.

5. Thermal Shutdown (TSD):

   • The device will shut down if the temperature exceeds 160°C to prevent thermal damage. The device will resume operation once the temperature drops below the threshold.

6. Operating Temperature (TOPR):

   • The device is designed to operate in ambient temperatures ranging from -40°C to 85°C. Ensure the operating environment stays within this range.

7. Storage Temperature (TSTG):

   • When storing the device, ensure the temperature is between -65°C and 150°C to maintain its integrity.

8. Mounting:

   • Use appropriate mounting techniques to ensure good thermal management. Consider using a heatsink if the device will be operating near its maximum current or in high ambient temperatures.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components. Use ESD protection measures during handling and installation.

10. Testing:

    • Before deploying the device in a final application, test it under typical operating conditions to ensure it meets performance specifications.

(For reference only)