HCPL-314J-000E

HCPL-314J-000E


Specifications
SKU
1925838
Details

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OPTOISO 5KV 2CH GATE DRIVER 16SO
Parameter Symbol Min Typ Max Unit
Forward Voltage VF - 1.2 1.6 V
Forward Current IF - 20 50 mA
Reverse Voltage VR - - 5 V
Reverse Current IR - - 100 nA
Isolation Voltage VI 1500 - 2500 VRMS
Propagation Delay Time tPLH/tPHL - 50 70 ns
Output Low Voltage VOL - 0.4 0.8 V
Output High Voltage VOH 2.4 - 5.5 V
Output Low Current IOL - - 16 mA
Output High Current IOH - - -5 mA
Operating Temperature TA -40 - 105 掳C
Storage Temperature TSTG -55 - 125 掳C

Instructions for Use:

  1. Power Supply:

    • Ensure the power supply voltage is within the specified range (VCC = 4.5V to 5.5V).
    • Connect the anode of the LED to the positive supply and the cathode to the ground through a current-limiting resistor.
  2. Forward Current:

    • Set the forward current (IF) to a value between 20mA and 50mA to ensure reliable operation.
    • Use a current-limiting resistor to prevent exceeding the maximum forward current.
  3. Reverse Voltage:

    • Do not apply a reverse voltage greater than 5V to the LED to avoid damage.
  4. Isolation Voltage:

    • The device provides isolation up to 2500VRMS. Ensure that the input and output circuits are properly isolated to maintain safety and performance.
  5. Propagation Delay:

    • The propagation delay time (tPLH and tPHL) should be considered when designing timing-sensitive applications. The typical delay is 50ns, with a maximum of 70ns.
  6. Output Levels:

    • Ensure that the output low voltage (VOL) does not exceed 0.8V and the output high voltage (VOH) is at least 2.4V to meet the logic level requirements of the connected circuit.
  7. Operating Temperature:

    • Operate the device within the temperature range of -40掳C to 105掳C to ensure reliable performance.
  8. Storage Temperature:

    • Store the device in an environment where the temperature ranges from -55掳C to 125掳C to prevent damage during storage.
  9. Handling:

    • Handle the device with care to avoid mechanical stress and static discharge. Use appropriate ESD protection measures.
  10. Mounting:

    • Follow the recommended PCB layout and mounting guidelines to ensure proper thermal management and electrical performance.
(For reference only)

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