Details
BUY MG50G2CH1 https://www.utsource.net/itm/p/2148297.html
Parameter | Description | Value | Unit |
---|---|---|---|
Part Number | Full part number | MG50G2CH1 | |
Type | Component type | MOSFET | |
Package | Package type | TO-220 | |
Drain Source Voltage | Maximum drain-source voltage | 50 | V |
Continuous Drain Current | Continuous drain current at 25°C | 2 | A |
Pulse Drain Current | Peak pulse drain current | 8 | A |
Gate Source Voltage | Maximum gate-source voltage | ±20 | V |
Power Dissipation | Maximum power dissipation | 62.5 | W |
Junction Temperature | Maximum junction temperature | 150 | °C |
Storage Temperature | Operating temperature range | -55 to +150 | °C |
Instructions for Use:
Handling Precautions:
- Handle with care to avoid damage to the leads and body.
- Use appropriate ESD protection when handling to prevent damage from static electricity.
Mounting:
- Ensure correct orientation before soldering.
- Do not exceed recommended torque values when securing screws in heatsink applications.
Soldering:
- Solder within the recommended temperature and time limits to avoid thermal damage.
- Allow adequate cooling post-soldering.
Electrical Connections:
- Verify all electrical connections are secure and meet specifications.
- Ensure gate drive circuitry is properly designed to minimize switching losses.
Thermal Management:
- Ensure adequate heat sinking if operating near maximum power dissipation.
- Monitor device temperature to ensure it stays within operational limits.
Storage:
- Store in a dry, cool environment away from direct sunlight.
- Keep in original packaging until ready for use to protect against ESD.
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