BSM35GD120DN2E322

BSM35GD120DN2E322

Category: Modules

Specifications
Details

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Parameter Description Value Unit
Device Type High Voltage Power MOSFET - -
Part Number BSM35GD120DN2E322 - -
Drain-Source Voltage (Vds) Maximum voltage that can be applied between drain and source terminals 1200 V
Continuous Drain Current (Id) Maximum continuous current through the drain terminal 35 A
Peak Pulse Drain Current (Idm) Maximum pulse current through the drain terminal 240 A
Gate-Source Voltage (Vgs) Maximum voltage that can be applied between gate and source terminals ±20 V
Rds(on) @ Vgs=15V On-resistance at given gate-source voltage 160
Total Power Dissipation (Ptot) Maximum power dissipation under specified conditions 197 W
Junction Temperature (Tj) Maximum allowable junction temperature 175 °C
Storage Temperature Range Temperature range for storage -55 to +175 °C
Package Type Packaging type D2PAK-7L -

Instructions:

  1. Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
  2. Mounting: Ensure proper thermal management by using adequate heatsinks or cooling solutions, especially when operating near maximum power dissipation.
  3. Soldering: Follow recommended soldering profiles to avoid damage. Typical reflow soldering temperatures should not exceed the maximum junction temperature.
  4. Operating Conditions: Operate within specified voltage and current limits to ensure reliable performance and longevity.
  5. Gate Drive: Ensure gate drive signals are within the specified gate-source voltage range to prevent gate oxide damage.
  6. Storage: Store in a dry, cool environment within the specified storage temperature range to maintain component integrity.
(For reference only)

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