Details
BUY BSM35GD120DN2E322 https://www.utsource.net/itm/p/2201291.html
Parameter | Description | Value | Unit |
---|---|---|---|
Device Type | High Voltage Power MOSFET | - | - |
Part Number | BSM35GD120DN2E322 | - | - |
Drain-Source Voltage (Vds) | Maximum voltage that can be applied between drain and source terminals | 1200 | V |
Continuous Drain Current (Id) | Maximum continuous current through the drain terminal | 35 | A |
Peak Pulse Drain Current (Idm) | Maximum pulse current through the drain terminal | 240 | A |
Gate-Source Voltage (Vgs) | Maximum voltage that can be applied between gate and source terminals | ±20 | V |
Rds(on) @ Vgs=15V | On-resistance at given gate-source voltage | 160 | mΩ |
Total Power Dissipation (Ptot) | Maximum power dissipation under specified conditions | 197 | W |
Junction Temperature (Tj) | Maximum allowable junction temperature | 175 | °C |
Storage Temperature Range | Temperature range for storage | -55 to +175 | °C |
Package Type | Packaging type | D2PAK-7L | - |
Instructions:
- Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
- Mounting: Ensure proper thermal management by using adequate heatsinks or cooling solutions, especially when operating near maximum power dissipation.
- Soldering: Follow recommended soldering profiles to avoid damage. Typical reflow soldering temperatures should not exceed the maximum junction temperature.
- Operating Conditions: Operate within specified voltage and current limits to ensure reliable performance and longevity.
- Gate Drive: Ensure gate drive signals are within the specified gate-source voltage range to prevent gate oxide damage.
- Storage: Store in a dry, cool environment within the specified storage temperature range to maintain component integrity.
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