74ACQ244SCX

74ACQ244SCX


Specifications
SKU
4088893
Details

BUY 74ACQ244SCX https://www.utsource.net/itm/p/4088893.html
4-Bit Non-Inverting Buffer / Driver
Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage 1.65 - 3.6 V
Input Low Voltage (VIH) Maximum input low voltage - - 0.8 V
Input High Voltage (VIL) Minimum input high voltage 2.0 - - V
Output Low Voltage (VOH) Minimum output high voltage 2.4 - - V
Output High Voltage (VOL) Maximum output low voltage - - 0.4 V
Propagation Delay Time (tpd) Time delay from input to output - 2.9 - ns
Power Dissipation (PD) Maximum power dissipation - - 340 mW
Operating Temperature (Toper) Range of operating temperature -40 - 85 °C
Storage Temperature (Tstg) Range of storage temperature -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65V to 3.6V.
    • Connect VCC to the positive supply and GND to the ground.
  2. Input Signals:

    • For a valid low input, the voltage should be less than or equal to 0.8V.
    • For a valid high input, the voltage should be greater than or equal to 2.0V.
  3. Output Signals:

    • The output will be considered high when the voltage is greater than or equal to 2.4V.
    • The output will be considered low when the voltage is less than or equal to 0.4V.
  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 2.9 nanoseconds. This is the time it takes for the output to respond to a change in the input signal.
  5. Temperature Considerations:

    • The device can operate within a temperature range of -40°C to 85°C.
    • Store the device in a temperature range of -65°C to 150°C.
  6. Power Dissipation:

    • The maximum power dissipation is 340 milliwatts. Ensure proper heat dissipation if operating near this limit.
  7. Handling:

    • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
  8. Mounting:

    • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
  9. Testing:

    • Test the device under specified conditions to ensure it meets the performance parameters listed above.
(For reference only)

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