Details

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BUY 74ACQ245SC https://www.utsource.net/itm/p/4088904.html
Quiet Series? Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	1.65	-	3.6	V	-
Input Low Voltage	VIL	-	-	0.8	V	VCC = 3.6V
Input High Voltage	VIH	2.0	-	-	V	VCC = 3.6V
Output Low Voltage	VOL	-	0.1	0.4	V	IOL = 32mA, VCC = 3.6V
Output High Voltage	VOH	2.4	-	-	V	IOH = -8mA, VCC = 3.6V
Input Leakage Current	IIL	-	-	±1	μA	VCC = 3.6V
Output Leakage Current	IOL	-	-	±1	μA	VCC = 3.6V
Propagation Delay Time	tpd	-	2.5	-	ns	VCC = 3.6V, TA = 25°C
Power Dissipation	PD	-	-	350	mW	Per Package
Operating Temperature	TA	-40	-	85	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 1.65V to 3.6V to avoid damage to the device.

2. Input Levels:

   • Input voltages should be within the specified ranges to ensure correct logic levels. For V_CC = 3.6V, V_IL should not exceed 0.8V, and V_IH should be at least 2.0V.

3. Output Levels:

   • The output voltages should be monitored to ensure they meet the required levels. V_OL should be less than or equal to 0.4V when sinking 32mA, and V_OH should be at least 2.4V when sourcing -8mA.

4. Leakage Current:

   • Keep input and output leakage currents within the specified limits to prevent unintended behavior.

5. Propagation Delay:

   • The propagation delay time is crucial for timing considerations. At V_CC = 3.6V and ambient temperature (TA) = 25°C, the typical propagation delay is 2.5ns.

6. Power Dissipation:

   • Ensure the power dissipation does not exceed 350mW per package to avoid overheating.

7. Operating and Storage Temperatures:

   • The device can operate within a temperature range of -40°C to 85°C and can be stored between -65°C and 150°C.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use proper ESD protection equipment.

9. Mounting and Soldering:

   • Follow recommended soldering profiles and temperatures to ensure reliable connections and prevent thermal damage.

10. Testing:

    • Perform initial testing under controlled conditions to verify the functionality of the device before integrating it into a larger system.

(For reference only)