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CAP DISCHRG 825V 500NF 8SOIC
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Capacitance | C | 1.8 | 2.2 | 2.4 | nF | |
| Voltage Rating | Vr | - | 50 | - | VDC | |
| Tolerance | ΔC | - | ±10 | - | % | |
| Temperature Coefficient | α | - | -330 | - | ppm/°C | |
| Insulation Resistance | Ri | 1000 | - | - | MΩ | @25°C |
| Dissipation Factor | Df | - | 0.5 | - | % | @1kHz |
| Operating Temperature | T | -55 | - | 125 | °C | |
| Storage Temperature | Ts | -55 | - | 150 | °C |
Instructions for Use:
- Capacitance Value: The nominal capacitance value is 2.2 nF with a tolerance of ±10%. Ensure that your circuit design accounts for this tolerance.
- Voltage Rating: The maximum voltage rating is 50 VDC. Do not exceed this voltage to avoid damage to the capacitor.
- Temperature Coefficient: The temperature coefficient is -330 ppm/°C, indicating that the capacitance will decrease by 0.033% for every degree Celsius increase in temperature.
- Insulation Resistance: At 25°C, the minimum insulation resistance is 1000 MΩ. This ensures low leakage current.
- Dissipation Factor: At 1 kHz, the dissipation factor is 0.5%, which indicates the efficiency of the capacitor in AC circuits.
- Operating Temperature Range: The capacitor can operate between -55°C and 125°C. Ensure that the operating environment stays within these limits.
- Storage Temperature Range: When storing the capacitor, ensure the temperature remains between -55°C and 150°C to maintain its performance characteristics.
Handling and Storage:
- Handling: Handle the capacitor with care to avoid mechanical stress or damage.
- Storage: Store in a dry, cool place away from direct sunlight and sources of heat.
- Soldering: Use a soldering iron with a temperature not exceeding 350°C for no more than 3 seconds per terminal to prevent thermal damage.
Mounting:
- Orientation: Ensure the correct orientation if the capacitor is polarized. For non-polarized capacitors, orientation is not critical.
- Mechanical Stress: Avoid applying excessive mechanical stress to the leads during installation.
- Board Layout: Place the capacitor as close as possible to the components it is decoupling to minimize inductance and improve performance.
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