Details

---

BUY CY62137VNLL-70ZSXET https://www.utsource.net/itm/p/4352972.html
SRAM 2MBIT 70NS 44TSOP

Parameter	Description	Value
Device Type	High-Speed CMOS Static RAM	512K x 8
Package Type	TSSOP (Thin Small Outline Package)	24-Pin
Supply Voltage (Vcc)	Operating Supply Voltage	2.5V to 3.6V
Standby Current (Icc)	Current Consumption in Standby Mode	2 μA (max)
Active Current (Icc)	Current Consumption in Active Mode	35 mA (max)
Access Time (tAA)	Access Time from Address Valid to Data Valid	70 ns (max)
Data Retention Time	Time Data is Retained Without Power Loss	20 years
Operating Temperature	Range of Operating Temperatures	-40°C to 85°C
Storage Temperature	Range of Storage Temperatures	-65°C to 150°C
Endurance	Number of Read/Write Cycles	Unlimited
Output Drive Strength	Output Drive Capability	24 mA
Input Clamping Voltage	Maximum Input Voltage with Clamp Diodes Active	±0.5V
Package Marking	Device Identification on Package	CY62137VNLL-70ZSXET

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.5V to 3.6V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Addressing:

   • Apply the desired address to the address lines (A0-A18) to select the memory location.
   • The chip select (CS) and output enable (OE) pins must be active (low) for the device to respond to address changes.

3. Data Input/Output:

   • For read operations, set the write enable (WE) pin high and the output enable (OE) pin low.
   • For write operations, set the write enable (WE) pin low and the output enable (OE) pin high.
   • Data is input or output through the data lines (DQ0-DQ7).

4. Timing:

   • Ensure that the access time (tAA) is respected to avoid data corruption. The maximum access time is 70 ns.
   • Maintain proper timing relationships between address, control, and data signals.

5. Temperature Considerations:

   • Operate the device within the specified temperature range of -40°C to 85°C.
   • Store the device in a temperature range of -65°C to 150°C to ensure long-term reliability.

6. Handling:

   • Handle the device with care to avoid damage to the pins and package.
   • Follow standard ESD (Electrostatic Discharge) precautions to prevent damage to the device.

7. Testing:

   • Perform functional tests to verify the operation of the device after installation.
   • Use appropriate test patterns to check all memory locations and functions.

8. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Keep the device in its original packaging until ready for use to protect against static and physical damage.

(For reference only)