Details

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BUY EP2C15AF256I8N https://www.utsource.net/itm/p/4424194.html
IC FPGA 152 I/O 256FBGA

Parameter	Description	Value
Device Name	Cyclone II FPGA	EP2C15AF256I8N
Package	FBGA (Fine-Pitch Ball Grid Array)	256 balls
Speed Grade	I8	-
Configuration Memory	Non-volatile Flash-based configuration memory	1.5 Mbits
Logic Elements (LEs)	Basic building blocks for logic functions	15,070
Embedded Multipliers	9-bit by 9-bit multipliers	132
RAM Blocks	4-Kbit dual-port RAM blocks	120
I/O Pins	Input/Output pins	256
PLLs	Phase-Locked Loops for clock management	2
Max. User I/O Banks	Groups of I/O pins that share common I/O standards and voltage levels	8
Max. User I/O Per Bank	Maximum number of I/O pins per bank	32
Operating Voltage	Supply voltage for the device	1.2V
I/O Voltage	Voltage for I/O pins	1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Temperature Range	Operating temperature range	-40°C to +85°C
Power Consumption	Typical power consumption	1.5W (static), 3.5W (dynamic)
Configuration Modes	Methods for configuring the FPGA	Active Serial, Passive Serial, JTAG, AS Configuration via USB Blaster
Programming Software	Software used for design entry, simulation, and programming	Quartus II

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage is set to 1.2V.
   • Verify that the I/O voltage is compatible with the connected devices (1.2V, 1.5V, 1.8V, 2.5V, or 3.3V).

2. Configuration:

   • Use the Quartus II software to create and compile your design.
   • Program the device using one of the supported configuration modes (Active Serial, Passive Serial, JTAG, AS Configuration via USB Blaster).
   • For AS Configuration via USB Blaster, ensure that the USB Blaster is properly connected and configured.

3. Clock Management:

   • Utilize the two PLLs for generating and managing the required clock signals.
   • Configure the PLLs using the Quartus II software to meet your specific timing requirements.

4. I/O Configuration:

   • Set the I/O standards and voltage levels for each bank according to your design needs.
   • Use the I/O banks efficiently to minimize routing congestion and improve performance.

5. Thermal Management:

   • Ensure adequate cooling if operating at high power levels or in high-temperature environments.
   • Monitor the device temperature to prevent overheating.

6. Testing and Debugging:

   • Use the built-in JTAG interface for boundary-scan testing and debugging.
   • Verify the functionality of your design using simulation and on-board testing.

7. Storage and Handling:

   • Store the device in a dry, static-free environment.
   • Handle the device with care to avoid damage to the delicate FBGA package.

(For reference only)