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BUY FAN7314MX https://www.utsource.net/itm/p/4454613.html
LCD Backlight Inverter Drive IC Fairchild Semiconductor 1 FAN7314MX LCD Backlight Inverter Drive IC 1 FAN731 4MX Datasheets Search Partnumber : Start with "FAN731 4MX " - Total : 73 ( 1/3 Page) NO Part no Electronics Description View Electronic Manufacturer 73 FAN7310 LCD Back Light Inverter Drive

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	VCC	4.5	10	20	V
Output Voltage	VOUT	-	5	-	V	Fixed
Quiescent Current	IQ	-	10	-	μA
Output Current	IOUT	-	150	-	mA	Continuous
Shutdown Current	ISD	-	1	-	μA
Operating Temperature	TOPR	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C
Thermal Resistance	θJA	-	150	-	°C/W

Instructions for Use:

1. Power Supply:

   • Connect the input voltage (VCC) to a stable power supply within the range of 4.5V to 20V.
   • Ensure that the power supply can provide sufficient current to meet the load requirements.

2. Output Configuration:

   • The output voltage (VOUT) is fixed at 5V. No external components are required for voltage regulation.

3. Load Connection:

   • Connect the load to the output pins (VOUT and GND). The maximum continuous output current is 150mA.

4. Shutdown Mode:

   • To put the device into shutdown mode, pull the SHDN pin low. The shutdown current is typically 1μA.
   • To resume normal operation, pull the SHDN pin high or leave it floating.

5. Thermal Management:

   • Ensure proper heat dissipation by mounting the device on a heatsink if operating at high temperatures or under high load conditions.
   • The thermal resistance (θJA) is 150°C/W, indicating that the device can dissipate heat effectively when properly mounted.

6. Operating and Storage Temperatures:

   • The device can operate over a temperature range of -40°C to 125°C.
   • Store the device in an environment with temperatures ranging from -65°C to 150°C.

7. Handling Precautions:

   • Handle the device with care to avoid static damage.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

8. PCB Layout:

   • Place the device close to the load to minimize trace lengths and reduce noise.
   • Use a ground plane to improve thermal performance and reduce electromagnetic interference (EMI).

9. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure proper functionality.
   • Verify the output voltage and current to ensure they meet the specified values.

(For reference only)