FM16W08-SGTR

FM16W08-SGTR

Category: IC ChipsMemory

Specifications
SKU
4468312
Details

BUY FM16W08-SGTR https://www.utsource.net/itm/p/4468312.html
IC FRAM 64K PARALLEL 28SOIC
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 4.5 5 5.5 V
Standby Current Icc(S) - 20 40 μA @ Vcc = 5V, Ta = 25°C
Active Current Icc(A) 10 30 50 mA @ Vcc = 5V, Ta = 25°C
Output Current per Pin Ioh - 20 25 mA @ Vcc = 5V, Ta = 25°C
Output Current per Pin Iol - 20 25 mA @ Vcc = 5V, Ta = 25°C
Input Voltage Range Vin 0 - Vcc V
Output Voltage Range Vout 0 - Vcc V
Operating Temperature Ta -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Package Type - - DIP-24 - -

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Use a stable power source to avoid fluctuations that can affect performance.
  2. Current Considerations:

    • The device draws a standby current of 20 to 40 μA and an active current of 10 to 50 mA.
    • Ensure the power supply can handle the maximum current requirements.
  3. Input and Output Voltage:

    • Input voltages (Vin) should be between 0V and Vcc.
    • Output voltages (Vout) will also be between 0V and Vcc.
  4. Temperature Range:

    • The device operates reliably within the temperature range of -40°C to 85°C.
    • Store the device in an environment where the temperature does not exceed -65°C to 150°C.
  5. Package Handling:

    • The FM16W08-SGTR comes in a DIP-24 package.
    • Handle the device with care to avoid damage to the pins and the package.
  6. Soldering:

    • Use appropriate soldering techniques to ensure reliable connections.
    • Avoid overheating the device during soldering, as it can damage the internal components.
  7. Testing:

    • After assembly, test the device under typical operating conditions to ensure it functions correctly.
    • Verify the supply voltage, input/output signals, and current consumption.
  8. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Keep the device away from static electricity sources to avoid ESD damage.
(For reference only)

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