Details

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BUY IR2214SS https://www.utsource.net/itm/p/4574020.html
HALF-BRIDGE GATE DRIVER IC

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	Vcc	10	-	30	V
Gate Charge	Qg	-	65	-	nC
Continuous Drain Current	Id	-	3.5	-	A
Peak Drain Current	Idp	-	6	-	A
Turn-On Delay Time	tdon	-	100	-	ns
Turn-Off Delay Time	tdoff	-	100	-	ns
Turn-On Rise Time	tr	-	50	-	ns
Turn-Off Fall Time	tf	-	50	-	ns
Operating Temperature	Tj	-40	-	150	°C

Instructions for IR2214SS

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 10V to 30V. Exceeding this range can damage the device.

2. Gate Charge (Qg):

   • The typical gate charge is 65 nC. This value is important for calculating the power dissipation during switching.

3. Continuous Drain Current (Id):

   • The continuous drain current should not exceed 3.5A to avoid overheating and potential damage.

4. Peak Drain Current (Idp):

   • The peak drain current can go up to 6A for short durations. Ensure that the load does not exceed this limit for extended periods.

5. Turn-On and Turn-Off Delays (tdon, tdoff):

   • The turn-on delay time (tdon) and turn-off delay time (tdoff) are both typically 100 ns. These values are crucial for timing considerations in your circuit design.

6. Turn-On and Turn-Off Transition Times (tr, tf):

   • The turn-on rise time (tr) and turn-off fall time (tf) are both typically 50 ns. These parameters help in designing the driving circuit to minimize switching losses.

7. Operating Temperature (Tj):

   • The operating temperature range is from -40°C to 150°C. Ensure proper heat sinking if operating at higher temperatures to prevent thermal runaway.

8. Mounting:

   • Use appropriate mounting techniques to ensure good thermal contact with the heatsink. Avoid mechanical stress on the leads.

9. Storage:

   • Store the device in a dry, cool place to prevent moisture damage. Follow ESD (Electrostatic Discharge) precautions to avoid damaging the device.

10. Testing:

    • Before integrating the IR2214SS into your final design, test it in a controlled environment to ensure it meets the required specifications.

11. Schematic Design:

    • Ensure that the schematic layout minimizes parasitic inductance and capacitance to improve performance and reliability.

12. PCB Layout:

    • Follow recommended PCB layout guidelines to optimize thermal performance and reduce electromagnetic interference (EMI).

(For reference only)