Details

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BUY MAX691ACSE+T https://www.utsource.net/itm/p/4641918.html
The MAX691ACSE+T is a single microprocessor (μP) supervisory circuit in 16 pin NSOIC package. This device is pin compatible upgrade to the MAX691 device. It improve performance with 30μA supply current, 200ms typical reset active delay on power-up and 6ns chip enable propagation delay. It include write protection of CMOS RAM or EEPROM, separate watchdog outputs, backup battery switchover and a RESET (complimentary) output that is valid with VCC down to 1V. The device is typically used in computers, controllers, intelligent instruments and critical μP power monitoring.

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.7	-	5.5	V
Output Current (Sink)	IOL	VOH = 0.4V, TA = 25°C	30	-	-	mA
Output Current (Source)	IOH	VOL = 3.5V, TA = 25°C	-	-	10	mA
Input Voltage Range	VI	-	0	-	VCC	V
Logic High Input Voltage	VIH	II = 1 μA	0.8 × VCC	-	VCC	V
Logic Low Input Voltage	VIL	II = 1 μA	0	-	0.2 × VCC	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25°C	10	-	-	ns
Power Dissipation	PD	Continuous	-	-	150	mW
Operating Temperature	TA	-	-40	-	85	°C
Storage Temperature	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.7V to 5.5V.
   • Connect a decoupling capacitor (typically 0.1μF) close to the V_CC and GND pins to filter out noise.

2. Input Signals:

   • Apply logic high input voltages (V_IH) between 0.8 × V_CC and V_CC.
   • Apply logic low input voltages (V_IL) between 0V and 0.2 × V_CC.

3. Output Current:

   • The device can sink up to 30mA per output when V_OH is 0.4V.
   • The device can source up to 10mA per output when V_OL is 3.5V.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) at V_CC = 5V and T_A = 25°C is 10ns.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to 85°C.
   • Store the device within the temperature range of -65°C to 150°C.

6. Power Dissipation:

   • Ensure that the power dissipation does not exceed 150mW continuously.

7. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.

8. Layout:

   • Place the device on a PCB with proper grounding and power distribution to minimize noise and ensure stable operation.

(For reference only)