Details

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BUY MAX934CSE+ https://www.utsource.net/itm/p/4650281.html
IC COMPARATOR QUAD W/REF 16-SOIC

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.7		5.5	V
Output Voltage Swing	VOUT	Load = 15pF	0.2		VCC-0.2	V
Propagation Delay	tpd	VCC = 5V, VI = VOH, VO = VOH, CL = 15pF	6.5	8.5	11.5	ns
Input Current	II	VI = 0 to VCC	-1		1	μA
Quiescent Current	IQ	No Inputs, VCC = 5V		50		μA
Output Leakage Current	IOL	VCC = 5V, VO = 0V	-100			nA
Output Leakage Current	IOH	VCC = 5V, VO = VCC			100	nA
Input Voltage Range	VI		-0.3		VCC+0.3	V
Storage Temperature Range	TSTG		-65		150	°C
Operating Temperature Range	TA	Commercial	0		70	°C
Operating Temperature Range	TA	Industrial	-40		85	°C

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.7V to 5.5V.
   • Use a stable power supply to avoid voltage fluctuations that could affect performance.

2. Input Signals:

   • The input voltage (V_I) should be within the range of -0.3V to V_CC + 0.3V to prevent damage to the device.
   • Ensure input signals are clean and free from excessive noise.

3. Output Signals:

   • The output voltage swing (V_OUT) will typically range from 0.2V to V_CC - 0.2V under normal operating conditions.
   • Use appropriate load capacitance (C_L) to match the intended application.

4. Propagation Delay:

   • The propagation delay (t_pd) is the time it takes for the output to respond to a change in the input signal. It is typically between 6.5ns and 11.5ns at 5V supply voltage.

5. Current Considerations:

   • The quiescent current (I_Q) is typically 50μA when no inputs are applied.
   • Ensure the output leakage currents (I_OL and I_OH) are within the specified limits to maintain reliable operation.

6. Temperature:

   • The device can operate over a wide temperature range, but different grades (commercial and industrial) have different temperature specifications.
   • Store the device in an environment with a temperature range of -65°C to 150°C.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.
   • Use a heat sink if necessary to manage thermal dissipation, especially in high-temperature applications.

By following these guidelines, you can ensure optimal performance and reliability of the MAX934CSE+ in your application.

(For reference only)