Details

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BUY MB85RS16PNF-G-JNERE1 https://www.utsource.net/itm/p/4656857.html
IC FRAM 16K SPI 20MHZ 8SOP

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	1.7	-	3.6	V
Standby Current	ICCS	VCC = 2.0V, TA = 25°C	-	0.1	1.0	μA
Active Current	ICCA	VCC = 2.0V, TA = 25°C	-	2.0	4.0	mA
Data Retention Current	ICR	VCC = 0V, TA = 25°C	-	0.0	1.0	nA
Access Time	tACC	VCC = 2.0V, TA = 25°C	0.3	-	0.5	μs
Cycle Time	tCYC	VCC = 2.0V, TA = 25°C	0.3	-	0.5	μs
Write Recovery Time	tWR	VCC = 2.0V, TA = 25°C	0.0	-	0.05	μs
Address Setup Time	tAS	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Address Hold Time	tAH	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Chip Enable Setup Time	tCES	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Chip Enable Hold Time	tCEH	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Output Enable Setup Time	tOES	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Output Enable Hold Time	tOEH	VCC = 2.0V, TA = 25°C	0.0	-	0.1	ns
Output High Level Voltage	VOH	VCC = 2.0V, TA = 25°C	1.5	-	2.0	V
Output Low Level Voltage	VOL	VCC = 2.0V, TA = 25°C	0.0	-	0.4	V
Input High Level Voltage	VIH	VCC = 2.0V, TA = 25°C	1.5	-	2.0	V
Input Low Level Voltage	VIL	VCC = 2.0V, TA = 25°C	0.0	-	0.4	V
Operating Temperature Range	TA	Operating	-40	-	85	°C
Storage Temperature Range	TSTG	Storage	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 1.7V to 3.6V.
   • The device should be powered from a stable power source to avoid fluctuations that can affect performance.

2. Current Consumption:

   • Monitor the standby current (ICCS) and active current (ICCA) to ensure they do not exceed the maximum values, especially during prolonged operation.
   • The data retention current (ICR) is minimal but should be considered in low-power applications.

3. Timing Parameters:

   • Adhere to the access time (tACC) and cycle time (tCYC) specifications to ensure reliable data read and write operations.
   • Observe the write recovery time (tWR) to prevent data corruption during write cycles.
   • Ensure all setup and hold times (tAS, tAH, tCES, tCEH, tOES, tOEH) are met to maintain proper signal integrity.

4. Voltage Levels:

   • Verify that the output high level voltage (VOH) and output low level voltage (VOL) are within the specified ranges to ensure correct logic levels.
   • Input signals should also comply with the input high level voltage (VIH) and input low level voltage (VIL) requirements.

5. Temperature:

   • Operate the device within the specified operating temperature range (-40°C to 85°C) to avoid thermal stress.
   • Store the device within the storage temperature range (-65°C to 150°C) to prevent damage during non-operational periods.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.

7. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
   • Use appropriate thermal management solutions if the device is expected to operate at higher temperatures or in high-power applications.

(For reference only)