Details
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SERIAL LINK INTERFACE
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 4.5 | - | 40 | V | |
| Output Voltage | VOUT | - | 5.0 | - | V | Fixed |
| Output Current | IOUT | - | 1.5 | 3.0 | A | |
| Quiescent Current | IQ | - | 5 | 10 | mA | |
| Dropout Voltage | VDROP | - | 0.7 | 1.2 | V | |
| Thermal Shutdown Temperature | TSD | - | 160 | - | °C | |
| Operating Junction Temperature | TJ | -40 | - | 150 | °C | |
| Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the input voltage (VIN) is within the range of 4.5V to 40V.
- The output voltage (VOUT) is fixed at 5.0V.
Output Current:
- The device can provide up to 3.0A of output current, with a typical value of 1.5A.
Quiescent Current:
- The quiescent current (IQ) is typically 5mA and can go up to 10mA.
Dropout Voltage:
- The dropout voltage (VDROP) is typically 0.7V and can be as high as 1.2V.
Thermal Management:
- The thermal shutdown temperature (TSD) is set at 160°C to protect the device from overheating.
- Ensure the operating junction temperature (TJ) stays between -40°C and 150°C.
Storage Conditions:
- Store the device in an environment where the temperature ranges from -65°C to 150°C.
Capacitors:
- Use appropriate input and output capacitors to stabilize the power supply and reduce noise. Typical values are 10μF for input and 10μF for output.
PCB Layout:
- Place the device close to the load to minimize trace resistance and inductance.
- Use wide traces for power and ground connections to handle the current efficiently.
Mounting:
- Ensure proper mounting to a heatsink if the device will operate near its maximum current or in high ambient temperatures.
Protection:
- The device includes internal overcurrent and thermal protection. However, external fuses or current-limiting resistors may be necessary for additional safety in some applications.
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