MC33887PNB

MC33887PNB


Specifications
SKU
4674109
Details

BUY MC33887PNB https://www.utsource.net/itm/p/4674109.html
A H-Bridge with Load Current Feedback
Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 5.5 - 40 V
Output Voltage (VOUT) Regulated output voltage 5.0 - - V
Quiescent Current (IQ) Supply current with no load - 1.2 - mA
Load Current (IOUT) Maximum continuous output current - - 3 A
Dropout Voltage (VDROP) Voltage difference between VIN and VOUT at maximum load - 0.6 - V
Thermal Shutdown Temperature (TSD) Temperature at which the device shuts down to prevent damage - - 160 °C
Operating Junction Temperature (TJ) Range of temperatures over which the device is guaranteed to operate -40 - 150 °C
Storage Temperature (TS) Range of temperatures over which the device can be stored -65 - 150 °C

Instructions for Using MC33887PNB

  1. Input Connection:

    • Connect the input voltage (VIN) to the appropriate pin, ensuring it is within the specified range (5.5V to 40V).
  2. Output Connection:

    • Connect the output voltage (VOUT) to the load, ensuring the load current does not exceed the maximum continuous output current (3A).
  3. Ground Connection:

    • Ensure a solid ground connection for both input and output to maintain stability and performance.
  4. Capacitors:

    • Place a 1μF ceramic capacitor close to the input pin to filter noise and stabilize the input voltage.
    • Place a 1μF ceramic capacitor close to the output pin to filter the output and ensure stable regulation.
  5. Thermal Management:

    • Ensure adequate heat dissipation by using a heatsink if the device is expected to operate at high loads or in high ambient temperatures.
    • Monitor the operating junction temperature (TJ) to avoid exceeding the maximum limit (150°C).
  6. Thermal Shutdown:

    • The device will automatically shut down if the thermal shutdown temperature (160°C) is exceeded to prevent damage. Allow the device to cool before resuming operation.
  7. Storage:

    • Store the device in a controlled environment within the specified storage temperature range (-65°C to 150°C).
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Use proper ESD protection measures.
  9. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required performance specifications.
(For reference only)

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