Details

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BUY MC74VHC245DTR2G https://www.utsource.net/itm/p/4688054.html
IC TXRX NON-INVERT 5.5V 20TSSOP

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	6.0	V
Input Low Voltage	VIL	VCC = 2.0V to 6.0V	-	-	0.8	V
Input High Voltage	VIH	VCC = 2.0V to 6.0V	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 16mA, VCC = 2.0V to 6.0V	-	-	0.4	V
Output High Voltage	VOH	IOH = -4mA, VCC = 2.0V to 6.0V	VCC - 0.4	-	VCC	V
Propagation Delay Time	tpd	VCC = 5.0V, TA = 25°C	-	6.0	-	ns
Power Dissipation	PD	Continuous	-	-	330	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0V to 6.0V. The device is designed to operate reliably within this range.

2. Input Voltages (V_IL, V_IH):

   • For proper operation, input low voltages should not exceed 0.8V, and input high voltages should be at least 2.0V but can go up to the supply voltage V_CC.

3. Output Voltages (V_OL, V_OH):

   • The output low voltage should not exceed 0.4V when sourcing 16mA, and the output high voltage should be at least V_CC - 0.4V when sinking -4mA.

4. Propagation Delay (t_pd):

   • The typical propagation delay time is 6.0ns at a supply voltage of 5.0V and ambient temperature of 25°C. This value can vary with different conditions.

5. Power Dissipation (P_D):

   • The maximum power dissipation is 330mW. Ensure that the device is not subjected to excessive power dissipation to avoid damage.

6. Operating Temperature (T_A):

   • The device can operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature stays within these limits.

7. Storage Temperature (T_STG):

   • When storing the device, ensure that the temperature remains between -65°C and 150°C to prevent damage.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components. Use appropriate ESD protection measures.

9. Mounting:

   • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB. Ensure good solder joints and proper alignment.

10. Testing:

    • Before using the device in a final application, test it under the intended operating conditions to ensure it meets the required performance specifications.

(For reference only)