Details

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Configurable Octal Serial Switch with Open Load Detect Current Disable

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	-	2.7	-	5.5	V
Operating Temperature	Toper	-	-40	-	85	°C
Storage Temperature	Tstg	-	-65	-	150	°C
Output Current (Sink)	Isink	Vcc = 5V, Ta = 25°C	-	200	-	mA
Output Current (Source)	Isource	Vcc = 5V, Ta = 25°C	-	200	-	mA
Input Capacitance	Cin	f = 1 MHz	-	10	-	pF
Output Capacitance	Cout	f = 1 MHz	-	10	-	pF
Leakage Current	Ileak	Vcc = 5V, Ta = 25°C	-	1	-	μA
Propagation Delay Time	tpd	Vcc = 5V, Ta = 25°C, Io = 10mA	10	-	30	ns
High-Level Output Voltage	VOH	Vcc = 5V, Io = 10mA	4.2	-	5.0	V
Low-Level Output Voltage	VOL	Vcc = 5V, Io = 10mA	0.0	-	0.4	V

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
   • Use appropriate decoupling capacitors (typically 0.1μF) close to the power pins to reduce noise.

2. Operating Temperature:

   • The device is designed to operate between -40°C and 85°C. Ensure that the ambient temperature does not exceed these limits.

3. Storage Temperature:

   • Store the device in a dry environment with temperatures ranging from -65°C to 150°C.

4. Output Current:

   • The maximum output current (sink or source) is 200mA. Do not exceed this limit to avoid damaging the device.

5. Input and Output Capacitance:

   • The input and output capacitance are typically 10pF at 1MHz. Consider this when designing your circuit to avoid signal degradation.

6. Leakage Current:

   • The leakage current is typically 1μA at room temperature. This should be accounted for in low-power applications.

7. Propagation Delay:

   • The propagation delay time is between 10ns and 30ns under typical operating conditions. This is important for timing-sensitive applications.

8. Output Voltage Levels:

   • Ensure that the high-level output voltage (VOH) is at least 4.2V and the low-level output voltage (VOL) is no more than 0.4V when the device is operating at 5V and sourcing/sinking 10mA.

9. Handling Precautions:

   • Handle the device with care to avoid static damage. Use ESD protection measures during handling and assembly.
   • Follow recommended soldering profiles to prevent thermal damage during PCB assembly.

(For reference only)