MT29F2G08ABAEAWP-I

MT29F2G08ABAEAWP-I


Specifications
Details

BUY MT29F2G08ABAEAWP-I https://www.utsource.net/itm/p/4834696.html

Parameter Description Value
Device Type NAND Flash Memory 2Gb, 3.3V
Package Type BGA (Ball Grid Array) 60-ball
Operating Voltage (Vcc) Supply voltage for core operations 2.7V to 3.6V
Interface I/O Interface 8-bit
Page Size Data size per page 2112 bytes (2K + 64)
Block Size Number of pages per block 64 pages/block
Plane Size Number of blocks per plane 2048 blocks/plane
Programming Time Maximum time required to program a page 250 μs
Erase Time Maximum time required to erase a block 1.8 ms
Read Time Maximum time required to read data from a page 25 μs
Data Retention Guaranteed retention period at specified conditions 10 years
Endurance Number of guaranteed program/erase cycles 100,000 cycles
Temperature Range Operating temperature range -40°C to +85°C
Storage Temperature Non-operating temperature range -55°C to +125°C

Instructions for Use:

  1. Power Supply: Ensure the supply voltage is within the specified operating range of 2.7V to 3.6V.
  2. Initialization: Upon power-up, the device should be initialized by sending the reset command.
  3. Command Sequence: Use the appropriate command sequences for read, program, and erase operations as detailed in the datasheet.
  4. Error Handling: Implement error checking mechanisms such as Bad Block Management and ECC (Error Correction Code).
  5. Thermal Considerations: Operate within the specified temperature ranges to ensure reliable performance and longevity.
  6. Handling Static: The device is sensitive to static electricity; handle with appropriate ESD precautions.
  7. Programming Guidelines: Follow the programming guidelines strictly to avoid damage or data corruption.

For more detailed instructions and advanced features, refer to the full datasheet provided by Micron Technology.

(For reference only)

View more about MT29F2G08ABAEAWP-I on main site