Details

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BUY MT29F8G08ABACAWP-IT:C https://www.utsource.net/itm/p/4835285.html

Parameter	Description	Value
Part Number	Full Part Number	MT29F8G08ABACAWP-IT:C
Memory Type	Type of Memory	NAND Flash
Density	Storage Capacity	8 Gb (1 GB)
Organization	Data Organization	16 planes, 128K pages/plane, 2K + 64B/page
Interface	Communication Interface	Toggle Mode 2.0
Vcc Supply Voltage	Operating Voltage Range	1.7V to 1.95V
VccI Supply Voltage	Input Voltage Range	1.7V to 1.95V
VccQ Supply Voltage	I/O Voltage Range	1.7V to 1.95V
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Package	Package Type	BGA (Ball Grid Array)
Package Size	Physical Dimensions	16mm x 16mm x 1.2mm
Pin Count	Number of Pins	169
Data Rate	Maximum Data Transfer Rate	400 MB/s (Toggle Mode 2.0)
ECC Requirement	Error Correction Code	Up to 48-bit ECC per 512 bytes
Endurance	Program/Erase Cycles	3,000 cycles (typical)
Retention	Data Retention	10 years at 25°C
Programming Time	Page Program Time	300 μs (max)
Read Time	Page Read Time	50 μs (max)
Block Erase Time	Block Erase Time	1.5 ms (max)
Command Set	Command Set Support	ONFI 2.3, Toggle Mode 2.0
RoHS Compliance	Environmental Compliance	RoHS Compliant

Instructions for Use:

1. Power Supply:

   • Ensure that the Vcc, VccI, and VccQ voltages are within the specified range (1.7V to 1.95V).
   • Use decoupling capacitors close to the power pins to reduce noise and ensure stable operation.

2. Signal Integrity:

   • Use controlled impedance traces for high-speed signals to minimize reflections and crosstalk.
   • Terminate high-speed lines as necessary to maintain signal integrity.

3. Initialization:

   • After applying power, wait for the device to complete its internal initialization before sending commands.
   • Check the status register to ensure the device is ready for operation.

4. Command Sequence:

   • Follow the command sequence as specified in the datasheet for read, write, and erase operations.
   • Use the appropriate ECC algorithm to correct errors during data transfer.

5. Temperature Considerations:

   • Operate the device within the industrial temperature range (-40°C to +85°C) to ensure reliable performance.
   • Avoid exposing the device to extreme temperatures outside this range.

6. Handling:

   • Handle the device with care to avoid physical damage.
   • Use ESD (Electrostatic Discharge) protection when handling the device to prevent damage from static electricity.

7. Software Support:

   • Use the provided software development kits (SDKs) and reference designs to facilitate integration into your system.
   • Refer to the datasheet and application notes for detailed programming and configuration information.

8. Storage:

   • Store the device in a dry, cool environment to prevent moisture damage.
   • Use proper packaging and storage methods to protect the device from physical damage during transport and storage.

(For reference only)