Details

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BUY MT48LC2M32B2TG-7IT:G https://www.utsource.net/itm/p/4840310.html

Parameter	Value	Notes
Device Type	2M x 32 SDRAM
Package Type	54-pin TSOP II
Supply Voltage (Vcc)	3.3V ± 0.3V
Operating Temperature	-40°C to +85°C	Industrial temperature range
Data Width	32 bits
Access Time (tAC)	7 ns
Cycle Time (tRC)	15 ns
Row Address Bits	12 bits
Column Address Bits	9 bits
Bank Address Bits	2 bits
Refresh Cycle	8192 refresh cycles per 64 ms
Power Consumption	200 mW (Typical)	Active mode
Standby Power	10 mW (Typical)	Standby mode
Input Voltage (Vccq)	3.3V ± 0.3V	I/O supply voltage
Output Drive Strength	24 mA (Max)
Slew Rate Control	Programmable
CAS Latency	CL = 3
Write Recovery Time	7 ns (Minimum)
Data Hold Time	0.5 ns (Minimum)
Data Setup Time	2.5 ns (Minimum)
Address Setup Time	2.5 ns (Minimum)
Clock Period	10 ns (Maximum)
Ordering Code	MT48LC2M32B2TG-7IT:G

Instructions for Use:

1. Power Supply:

   • Ensure that the Vcc and Vccq are within the specified range (3.3V ± 0.3V).
   • Use decoupling capacitors close to the power pins to minimize noise.

2. Clock Signal:

   • The clock signal should be clean and have a period of no more than 10 ns.
   • Use a stable clock source to avoid timing issues.

3. Address and Data Lines:

   • Address lines (A0-A11, BA0-BA1) must be stable before the address setup time.
   • Data lines (DQ0-DQ31) should be held stable during the data setup and hold times.

4. Refresh:

   • Perform 8192 refresh cycles every 64 ms to maintain data integrity.
   • Use auto-refresh or self-refresh modes as needed.

5. Write Operations:

   • Ensure that the write recovery time (tWR) is at least 7 ns to prevent data corruption.
   • Data should be held on the data lines for the required setup and hold times.

6. Read Operations:

   • The access time (tAC) is 7 ns, so ensure that the read cycle is timed accordingly.
   • Use appropriate CAS latency settings (CL = 3).

7. Standby Mode:

   • To reduce power consumption, use the standby mode by deactivating all banks and entering self-refresh or power-down states.

8. Slew Rate Control:

   • Adjust the slew rate control to match the system requirements and reduce EMI.

9. Handling:

   • Handle the device with care to avoid static damage.
   • Follow ESD protection guidelines during handling and installation.

10. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Use anti-static packaging when storing or transporting the device.

(For reference only)