Details

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Parameter	Description	Value
Device Type	Synchronous DRAM (SDRAM)	256 Mb
Organization	x32
Supply Voltage (Vcc)	I/O Supply Voltage	3.3V ± 0.3V
Supply Voltage (Vccq)	I/O Supply Voltage for DLL	3.3V ± 0.3V
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Access Time	tAC (Access Time from Clock)	7 ns
Cycle Time	tRC (Row Cycle Time)	45 ns
CAS Latency	CL (CAS Latency)	3
Refresh Rate	tREF (Refresh Period)	64 ms
Row Address Strobe	tRAS (Minimum Active to Precharge Delay)	45 ns
Column Address Strobe	tRCD (Row to Column Delay)	20 ns
Precharge Time	tRP (Precharge Command Period)	20 ns
Write Recovery Time	tWR (Write Recovery Time)	15 ns
Power Down Mode	Self Refresh or Power Down Entry/Exit	100 ns
Package Type	TSOP II (Thin Small Outline Package)	54-pin
Pin Configuration	See datasheet for detailed pin configuration

Instructions for Use:

1. Power Supply:

   • Connect Vcc and Vccq to 3.3V ± 0.3V.
   • Ensure stable power supply to avoid data corruption.

2. Clock Signal:

   • Provide a stable clock signal to the CLK input.
   • The device is synchronous and operates on the rising edge of the clock.

3. Address and Control Signals:

   • Apply row and column addresses to the address lines (A0-A12).
   • Use control signals (CS#, RAS#, CAS#, WE#) to initiate read/write operations.

4. Data Input/Output:

   • Data is transferred on the DQ0-DQ31 lines.
   • Ensure proper termination and impedance matching for reliable data transfer.

5. Refresh Operation:

   • Perform refresh cycles every 64 ms to maintain data integrity.
   • Use the self-refresh mode for low-power applications.

6. Power Management:

   • Enter power-down mode by deactivating CS# and setting the mode register accordingly.
   • Exit power-down mode by reactivating CS# and performing a NOP command.

7. Initialization:

   • After power-up, perform a reset sequence followed by mode register set (MRS) commands to configure the device.
   • Refer to the datasheet for specific initialization sequences.

8. Handling and Storage:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Store in a dry, ESD-safe environment when not in use.

For more detailed information, refer to the MT48LC2M32B2P-7IT:G datasheet provided by the manufacturer.

(For reference only)