Details

---

BUY MAX126CCAX+D https://www.utsource.net/itm/p/4853068.html
IC DAS 14BIT 250K 36SSOP

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.75		5.25	V
Supply Current	ICC	All channels off		1.5		mA
Input Voltage Range	VIN		0		VCC - 0.3	V
Output Voltage High	VOH	IL = -1mA	VCC - 0.1		VCC - 0.1	V
Output Voltage Low	VOL	IL = 1mA	0.1		0.1	V
Channel-to-Channel Isolation	VISO	500Vrms, 1 minute		500		Vrms
Maximum Repetitive Peak Reverse Voltage	VRSM				500	V
Maximum RMS Reverse Voltage	VRMS				353	V
Maximum Forward Current	IF	TA = 25°C		1.0		A
Junction Temperature	TJ	Operating	-40		125	°C
Storage Temperature	TSTG		-65		150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V.
   • Connect the V_CC pin to a stable power source.

2. Input Voltage (V_IN):

   • The input voltage should be between 0V and V_CC - 0.3V.
   • Avoid exceeding these limits to prevent damage to the device.

3. Output Voltage (V_OH, V_OL):

   • When the output is high, it will be close to V_CC - 0.1V.
   • When the output is low, it will be close to 0.1V.
   • Ensure the load current does not exceed the specified limits to maintain proper output levels.

4. Channel-to-Channel Isolation:

   • The device provides 500Vrms isolation between channels for 1 minute.
   • This isolation helps protect against electrical faults and ensures safe operation.

5. Maximum Reverse Voltage:

   • The maximum repetitive peak reverse voltage (V_RSM) is 500V.
   • The maximum RMS reverse voltage (V_RMS) is 353V.
   • Ensure these limits are not exceeded to avoid damage.

6. Forward Current (I_F):

   • The maximum forward current is 1.0A at 25°C.
   • Ensure adequate heat dissipation if operating near this limit.

7. Temperature Considerations:

   • The junction temperature (T_J) should be kept between -40°C and 125°C.
   • The storage temperature (T_STG) should be between -65°C and 150°C.
   • Use appropriate thermal management techniques to maintain these temperature ranges.

8. Handling and Installation:

   • Handle the device with care to avoid static damage.
   • Follow standard PCB assembly practices to ensure reliable soldering and connections.

9. Testing and Verification:

   • Perform initial testing under controlled conditions to verify correct operation.
   • Monitor performance parameters regularly to ensure continued reliability.

(For reference only)