Details
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| Parameter | Description | Value | Unit |
|---|---|---|---|
| Product Name | High-Speed Synchronous DRAM | MT46V16M16CY | |
| Organization | Micron Technology | ||
| Package Type | FBGA (Fine Pitch Ball Grid Array) | 60-ball | |
| Supply Voltage | Operating voltage range for the device | 2.5 | V |
| I/O Standard | I/O voltage standard | SSTL_2 or SSTL_3 | |
| Data Width | Number of data lines | x16 | bits |
| Memory Density | Total memory capacity | 128Mb | |
| Speed Grade | Access time | -6 | ns |
| Refresh Rate | Time interval in which refresh must be completed | 7.8us | |
| CAS Latency | Column Address Strobe latency | 3, 2.5, 2 | clocks |
| Burst Length | Number of consecutive reads/writes | 2, 4, 8 | |
| Operating Temperature | Range of temperatures where the device can operate | 0 to 70 | °C |
| Storage Temperature | Range of temperatures where the device can be stored | -40 to 85 | °C |
Instructions for Use:
- Power Supply Setup: Ensure that the supply voltage is set to 2.5V as specified. Verify that the power supply is stable and within tolerance before applying power to the device.
- Signal Integrity: Maintain proper signal integrity by using controlled impedance traces for address, control, and data lines. Terminate these lines according to the guidelines provided in the datasheet.
- Clock Management: Provide a stable clock signal to the device. Ensure that the clock signal has minimal jitter and skew relative to other signals.
- Initialization: After power-up, initialize the device by performing a mode register set command followed by a precharge all banks command.
- Refresh Operations: Implement a refresh cycle every 7.8 microseconds to prevent data loss. The refresh can be either auto-refresh or self-refresh depending on system requirements.
- Read/Write Operations: Configure the CAS latency and burst length settings based on system performance needs. Perform read and write operations following the timing diagrams provided in the datasheet.
- Error Handling: Incorporate error detection mechanisms such as ECC (Error Correction Code) if required by the application.
- Thermal Management: Monitor the operating temperature to ensure it stays within the specified range. Use heat sinks or cooling solutions if necessary.
For detailed specifications and advanced configuration options, refer to the official datasheet provided by Micron Technology.
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