Details
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| Parameter | Description | Value |
|---|---|---|
| Product Name | 256Mb DDR3 SDRAM | MT47H32M16HR-25EIT:G |
| Organization | Micron Technology | |
| Package Type | FBGA | 96-ball |
| Operating Voltage | VDD, VDDQ | 1.35V ± 0.135V |
| Data Width | x16 | |
| Memory Density | 256Mb | |
| Speed Grade | 2533 Mbps (CL = 11) | |
| Temperature Range | Commercial (-40°C to +85°C) | |
| Refresh Rate | 7.8us (self-refresh) | |
| Access Time | tAA | 14.6ns |
| CAS Latency | CL | 11 |
| Write Recovery Time | tWR | 15 cycles |
| Row Address Strobe | tRAS | 38.75ns |
| Active to Precharge Delay | tRP | 14.6ns |
| Cycle Time | tRC | 53.3ns |
| Power Down Mode | Available | |
| Self Refresh Mode | Available | |
| On-Die Termination | Available |
Instructions for Use:
Power Supply Requirements: Ensure the power supply voltage (VDD and VDDQ) is set to 1.35V ± 0.135V. Incorrect voltage can lead to device malfunction or damage.
Initialization: Before accessing memory, initialize the device by setting up mode registers as specified in the datasheet. This includes setting the CAS latency (CL) and other timing parameters.
Timing Parameters: Adhere strictly to the specified timing parameters such as access time (tAA), write recovery time (tWR), row address strobe (tRAS), active to precharge delay (tRP), and cycle time (tRC). Non-compliance can result in data corruption or operational instability.
Refresh Operations: Implement a refresh cycle every 7.8 microseconds to maintain data integrity. Use self-refresh mode during periods of inactivity to reduce power consumption.
Power Management: Utilize power-down and self-refresh modes to minimize power consumption when the device is not actively being used.
Signal Integrity: Ensure signal integrity by properly terminating all control and data lines. On-die termination should be enabled to improve signal quality.
Handling Precautions: Handle the device with care to avoid electrostatic discharge (ESD) damage. Follow anti-static protocols during installation and handling.
Environmental Conditions: Operate within the specified temperature range (-40°C to +85°C) to ensure reliable performance. Avoid exposing the device to conditions outside this range.
For detailed specifications and advanced configurations, refer to the official Micron Technology datasheet for MT47H32M16HR-25EIT:G.
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