MT48LC32M16A2P-75C

MT48LC32M16A2P-75C


Specifications
SKU
4906540
Details

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Parameter Description Value
Device Type Memory Device 32 Mbit (4M x 8, 2M x 16, 1M x 32) SDRAM
Package Package Type 54-pin TSOP (Thin Small Outline Package)
Supply Voltage (VCC) Operating Voltage Range 2.5V ± 0.2V
Supply Voltage (VCCQ) I/O Supply Voltage 2.5V ± 0.2V
Data Width Data Bus Width 16 bits
Row Address Bits Number of Row Address Bits 13 bits
Column Address Bits Number of Column Address Bits 9 bits
Bank Address Bits Number of Bank Address Bits 2 bits
Access Time (tAC) Access Time from Clock Edge to Data Valid 7.5 ns max
Cycle Time (tRC) Row Cycle Time 60 ns max
Refresh Cycle Time (tREF) Refresh Cycle Time 64 ms max
Operating Temperature Industrial Temperature Range -40°C to +85°C
Storage Temperature Storage Temperature Range -65°C to +150°C
Power Consumption Active Power Consumption 1.0W typ (at 133 MHz)
Standby Power Consumption Standby Power Consumption 0.05W typ

Instructions for Use:

  1. Power Supply:

    • Ensure that both VCC and VCCQ are supplied with 2.5V ± 0.2V.
    • Use decoupling capacitors close to the power supply pins to minimize noise.
  2. Addressing:

    • The device supports 13 row address bits, 9 column address bits, and 2 bank address bits.
    • Address lines should be stable before the rising edge of the clock signal.
  3. Clock Signal:

    • The device operates with a single-ended clock input (CLK).
    • Ensure the clock signal is clean and has a stable frequency.
  4. Control Signals:

    • /CS (Chip Select): Low to enable the device.
    • /RAS (Row Address Strobe): Low to initiate a row access.
    • /CAS (Column Address Strobe): Low to initiate a column access.
    • /WE (Write Enable): Low to write data, high to read data.
    • /DQM (Data Mask): Used to mask individual bytes during write operations.
  5. Refresh:

    • The device requires a refresh cycle every 64 ms.
    • Use an auto-refresh command to perform the refresh operation.
  6. Initialization:

    • After power-up, the device must be initialized by issuing a precharge all banks command followed by a mode register set command.
  7. Mode Register:

    • The mode register can be programmed to set various operating modes such as burst length, burst type, and CAS latency.
  8. Data Access:

    • Data is valid after the specified access time (tAC) from the clock edge.
    • Ensure that the data bus is not driven by external devices during read operations.
  9. Temperature Considerations:

    • Operate the device within the specified industrial temperature range (-40°C to +85°C).
    • Store the device in the specified storage temperature range (-65°C to +150°C).
  10. Power Management:

    • Use the standby mode to reduce power consumption when the device is not in use.
    • Ensure proper sequencing of power supply voltages during power-up and power-down.

By following these instructions, you can ensure reliable and efficient operation of the MT48LC32M16A2P-75C SDRAM.

(For reference only)

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