Details
BUY MT48LC16M8A2TG-75:G https://www.utsource.net/itm/p/4907226.html
| Parameter | Description | Value |
|---|---|---|
| Device Type | 16M-Bit (2M x 8) Synchronous DRAM | MT48LC16M8A2TG-75:G |
| Organization | 2,097,152 words x 8 bits | |
| Supply Voltage (Vcc) | Operating supply voltage | 3.3V |
| Supply Voltage (Vccq) | I/O supply voltage | 3.3V |
| Access Time (tAA) | Random access time from clock edge | 7.5 ns |
| Cycle Time (tRC) | Row cycle time | 50 ns |
| Row Precharge Time (tRP) | Row precharge time | 18 ns |
| Column-to-Column Delay (tCCD) | Column-to-column delay without change of bank or row | 2 cycles |
| Refresh Period (tREF) | Refresh period | 64 ms |
| Operating Temperature | Industrial temperature range | -40°C to +85°C |
| Package Type | Thin Small Outline Package with lead-free and halogen-free material | TSOP II |
| Pin Count | Number of pins | 66 pins |
Instructions for Use:
- Power Supply Requirements: Ensure that both Vcc and Vccq are supplied at 3.3V. Stable power supply is critical for reliable operation.
- Clock Signal: Provide a stable clock signal to the device. The access time is specified relative to the clock edge.
- Initialization: After power-up, ensure proper initialization according to the JEDEC standard for SDRAMs. This includes issuing a PRECHARGE ALL command followed by an AUTO REFRESH command at least once every refresh period.
- Addressing: Use the address lines to specify the row and column addresses for read/write operations. Address multiplexing requires correct timing and sequencing.
- Command Sequencing: Follow the command sequence as defined in the datasheet for operations such as READ, WRITE, REFRESH, PRECHARGE, etc.
- Temperature Considerations: Operate within the specified temperature range (-40°C to +85°C) to avoid thermal stress and potential damage.
- Handling Precautions: Handle the device with care to prevent electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure proper mounting on the PCB with attention to layout guidelines to minimize noise and improve signal integrity.
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