Details

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BUY MT48LC4M16A2P-75G https://www.utsource.net/itm/p/4909442.html
SDR SDRAM MT48LC16M4A2 4 Meg x 4 x 4 Banks MT48LC8M8A2 2 Meg x 8 x 4 Banks MT48LC4M16A2 1 Meg x 16 x 4 Banks

Parameter	Description	Value	Unit
Type	Memory Type	SDRAM
Density	Total Memory Density	64 Mbit (4M x 16)
Organization	Data Width	16-bit
Supply Voltage (Vcc)	Operating Range	3.0 to 3.6	V
Supply Voltage (Vccq)	I/O Supply Voltage	3.0 to 3.6	V
Operating Temperature	Commercial	0 to 70	°C
Industrial Temperature	Industrial	-40 to 85	°C
Access Time (tAC)	Access Time from Clock Edge	7.5	ns
Cycle Time (tRC)	Row Cycle Time	60	ns
Row Address Strobe (tRAS)	Minimum Active Time	45	ns
Column Address Strobe (tRCD)	RAS to CAS Delay	20	ns
Precharge Time (tRP)	Precharge Time	20	ns
Refresh Cycle Time (tRFC)	Refresh Cycle Time	70	ns
Data Output Enable (tOE)	Data Output Enable	10	ns
Data Output Disable (tOH)	Data Output Disable	10	ns
Power Down Mode Entry (tPD)	Power Down Mode Entry	2	ns
Power Down Mode Exit (tXP)	Power Down Mode Exit	20	ns
Package	Package Type	TSOP II (46-pin)
RoHS Compliance	RoHS Compliant	Yes

Instructions for Use:

1. Power Supply:

   • Ensure that both Vcc and Vccq are within the specified operating range (3.0 to 3.6V).
   • Use appropriate decoupling capacitors near the power supply pins to reduce noise.

2. Clock Signal:

   • The clock signal (CLK) must be stable and clean to ensure proper operation.
   • The access time (tAC) is measured from the rising edge of the clock signal.

3. Address and Control Signals:

   • Address lines (A0-A11) should be stable before the rising edge of the clock.
   • Control signals (CS#, RAS#, CAS#, WE#) should also be stable before the clock edge.

4. Data Input/Output:

   • Data input (DQ0-DQ15) should be valid during the write cycle.
   • Data output is valid after the specified data output enable time (tOE).

5. Refresh:

   • Perform a refresh cycle every 64ms to maintain data integrity.
   • The refresh cycle time (tRFC) is 70ns.

6. Power Management:

   • To enter power-down mode, set the CS# and CKE signals low.
   • To exit power-down mode, set CKE high and wait for the specified exit time (tXP).

7. Temperature Considerations:

   • Ensure the device operates within the specified temperature range to avoid damage or malfunction.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow ESD (Electrostatic Discharge) precautions during handling and installation.

(For reference only)