Details

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BUY MX25L6406EMI-12G https://www.utsource.net/itm/p/4914776.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.7	-	3.6	V
Standby Current	ICC(STANDBY)	VCC = 3.0V, VCC = 3.6V	-	1.0	-	μA
Active Current	ICC(ACTIVE)	VCC = 3.0V, VCC = 3.6V	-	2.0	-	mA
Programming Current	IPROG	VCC = 3.0V, VCC = 3.6V	-	2.0	-	mA
Write Time	tPROGRAM	Page Program	-	5	-	ms
Erase Time	tERASE	Sector Erase	-	30	-	ms
Block Erase	tERASE	Block Erase	-	200	-	ms
Chip Erase	tERASE	Chip Erase	-	800	-	ms
Data Retention	-	-	10	-	-	years
Operating Temperature	TA	Operating	-40	-	85	°C
Storage Temperature	TSTORAGE	Non-operating	-65	-	150	°C
Package Type	-	-	-	-	-	SOIC-8

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.7V to 3.6V.
   • Connect the ground pin (GND) to a stable ground reference.

2. Initialization:

   • Apply the supply voltage (V_CC) before any data operations.
   • Ensure the device is properly reset by applying a low pulse to the reset pin (if available).

3. Data Operations:

   • Read Operation:
     • Apply the appropriate read command sequence to the serial interface.
     • The data will be output on the data pin (DO) after the specified access time.
   • Write Operation:
     • Apply the write enable command (WREN) before any write operation.
     • Follow the write enable with the appropriate write command sequence.
     • Ensure the write time (t_PROGRAM) is respected to avoid data corruption.
   • Erase Operation:
     • Apply the erase enable command (WREN) before any erase operation.
     • Follow the erase enable with the appropriate erase command sequence.
     • Ensure the erase time (t_ERASE) is respected to avoid incomplete erasure.

4. Standby Mode:

   • To enter standby mode, apply the deep power-down (DPD) command.
   • The device will draw minimal current (I_CC(STANDBY)) during this mode.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (-40°C to 85°C).
   • Store the device within the specified storage temperature range (-65°C to 150°C) to ensure long-term reliability.

6. Handling Precautions:

   • Handle the device with care to avoid static discharge.
   • Use proper ESD protection measures when handling the device.

7. Package Information:

   • The device is available in an SOIC-8 package.
   • Refer to the datasheet for detailed pin configurations and mechanical dimensions.

(For reference only)