PM8834TR

PM8834TR


Specifications
SKU
5011028
Details

BUY PM8834TR https://www.utsource.net/itm/p/5011028.html
4 A dual low side MOSFET driver
Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 2.7 - 5.5 V
Output Voltage VOUT - 1.8 - V Fixed
Output Current IOUT - 0.3 0.5 A
Quiescent Current IQ - 60 - μA
Dropout Voltage VDROPOUT - 250 - mV @ IOUT=0.3A
Shutdown Current ISD - 0.1 - μA
Operating Junction Temp TJ -40 - 125 °C
Storage Temperature TSTG -40 - 150 °C
Thermal Resistance (θJA) - - 120 - °C/W

Instructions for Use:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the positive terminal of the power supply.
    • Ensure the input voltage is within the range of 2.7V to 5.5V.
  2. Output Configuration:

    • The output voltage (VOUT) is fixed at 1.8V. No external resistors are required for voltage adjustment.
  3. Load Connection:

    • Connect the load between the output (VOUT) and ground (GND).
    • Ensure the load current does not exceed 0.5A to avoid overheating or damage.
  4. Ground Connection:

    • Ensure a solid ground connection to both the input and output circuits to maintain stability and performance.
  5. Thermal Management:

    • The device has a thermal resistance (θJA) of 120°C/W. Ensure adequate heat dissipation, especially when operating at higher currents or in high ambient temperatures.
    • Do not exceed the maximum operating junction temperature (TJ) of 125°C.
  6. Shutdown Mode:

    • To place the device in shutdown mode, pull the enable pin (EN) low. The shutdown current (ISD) is typically 0.1μA.
    • To activate the device, pull the enable pin high.
  7. Storage and Handling:

    • Store the device in a dry environment with temperatures between -40°C and 150°C.
    • Handle the device with care to avoid static discharge and physical damage.
  8. PCB Layout:

    • Use a well-designed PCB layout with short traces and adequate copper area for heat dissipation.
    • Place bypass capacitors close to the input and output pins to filter noise and ensure stability.
  9. Testing:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.
  10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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