Details

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BUY SN74HCT540N https://www.utsource.net/itm/p/5103954.html
OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	2.0	-	6.0	V
Output High Level Voltage	VOH	-	VCC - 0.25	VCC - 0.15	V	IO = -400 μA
Output Low Level Voltage	VOL	0.1	0.2	0.35	V	IO = 4 mA
Input High Level Voltage	VIH	2.0	-	VCC	V
Input Low Level Voltage	VIL	0	-	0.8	V
Propagation Delay Time (Typ)	tpd	-	14	-	ns	VCC = 5V, TA = 25°C
Power Consumption	ICC	-	10	-	μA	VCC = 5V, No Load
Operating Temperature Range	TA	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
   • Connect V_CC to the positive power supply and GND to ground.

2. Input Signals:

   • Apply input signals (VIH, VIL) that meet the specified voltage levels.
   • Avoid floating inputs; use pull-up or pull-down resistors if necessary.

3. Output Signals:

   • The output high level (VOH) should be close to V_CC when the output is high.
   • The output low level (VOL) should be close to 0V when the output is low.
   • Ensure the load current does not exceed the maximum ratings.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 14 ns at V_CC = 5V and TA = 25°C.
   • Adjust timing considerations accordingly for different operating conditions.

5. Temperature:

   • Operate the device within the temperature range of -40°C to 85°C.
   • Store the device within the storage temperature range of -65°C to 150°C.

6. Power Consumption:

   • The typical power consumption (ICC) is 10 μA at V_CC = 5V with no load.
   • Consider power consumption in low-power applications.

7. Handling:

   • Handle the device with care to avoid static damage.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and assembly.

8. Mounting:

   • Ensure proper mounting on the PCB to maintain good thermal performance.
   • Follow recommended soldering profiles and reflow temperatures.

9. Testing:

   • Verify the functionality of the device using test vectors and known good signals.
   • Monitor power supply and signal integrity during testing.

(For reference only)